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VIDEO DOI: https://doi.org/10.48448/m2d3-pn66
PAPER DOI: 10.1109/IRPS48227.2022.9764409

technical paper

IRPS 2022

March 28, 2021

Dallas, TX, United States

A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability

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