Lecture image placeholder

Premium content

Access to this content requires a subscription. You must be a premium user to view this content.

Monthly subscription - $9.99Pay per view - $4.99Access through your institutionLogin with Underline account
Need help?
Contact us
Lecture placeholder background

technical paper

IRPS 2022

March 28, 2021

Dallas, TX, United States

Universal Hot Carrier Degradation Model under DC and AC Stress

Please log in to leave a comment


SlidesTranscript English (automatic)

Next from IRPS 2022

Latchup Vulnerability at the 7-nm FinFET Node
technical paper

Latchup Vulnerability at the 7-nm FinFET Node

IRPS 2022

Nicholas Pieper and 4 other authors

28 March 2021

Stay up to date with the latest Underline news!

Select topic of interest (you can select more than one)


  • All Lectures
  • For Librarians
  • Resource Center
  • Free Trial
Underline Science, Inc.
1216 Broadway, 2nd Floor, New York, NY 10001, USA

© 2023 Underline - All rights reserved