United States

A modular, UHV sealed FEG operational betwee 30-100 keV has been developed. This design lends itself to integration onto thermionically operated TEMs, EBL into FEG operation or in R &amp; D applications. Graphitic carbon and gold particles have been resolved confirming a resolution of better than 0.24nm at 60-100 keV.

EIPBN 2021

A modular 100 keV vacuum sealed FEG

cryoem

100 kv

field emission gun (feg)

The Institute of Physics and IOP Publishing, in partnership with the Chinese Physical Society (CPS) and the University of Science and Technology of China (USTC) are proud to have brought together the international quantum science community online for this inaugural conference.


Early career and leading researchers from universities, industry and government worldwide came together to share, learn and collaborate on the latest research and emerging areas of high interest across quantum science and technology. The broad themes covered by Quantum 2020 included:

Quantum communication;
Quantum computing and quantum simulation;
Quantum sensing, metrology and imaging;
Quantum information theory, software and algorithms;
Quantum foundations;
Quantum technology in industry.
The four-day event featured talks from world-renowned scientists, interactive poster sessions and two exciting panel discussions on the themes of Quantum Technology in Industry and Quantum Technology Programmes Around the World.


You will need to [register](https://www.iopconferences.org/iop/frontend/reg/tRegisterEmailNew.csp?pageID=978403&eventID=1552&tempPersonID=536224) to obtain a ticket. . If you have already registered you should have been sent an email from Underline (to the email address that you registered with) with the subject line ‘Welcome to Quantum 2020’. This email includes your ticket for the event. 

If you have a ticket and are experiencing problems in accessing the event, please contact us. 

Quantum 2020

The Institute of Physics and IOP Publishing, in partnership with the Chinese Physical Society (CPS) and the University of Science and Technology of China (USTC) are proud to have brought together the international quantum science community online for this inaugural conference.

Early career and leading researchers from universities, industry and government worldwide came together to share, learn and collaborate on the latest research and emerging areas of high interest across quantum science and technology. 

A modular, UHV sealed FEG operational betwee 30-100 keV has been developed. This design lends itself to integration onto thermionically operated TEMs, EBL into FEG operation or in R & D applications. Graphitic carbon and gold particles have been resolved confirming a resolution of better than 0.24nm at 60-100 keV.

poster

The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as "3-Beams," is the premier gathering of scientists and engineers who are dedicated to electron, ion and photon lithography, imaging, and analysis; atomically precise fabrication; nanofabrication process technologies and related emerging technologies; and their applications in a broad spectrum of fields. In its 64th meeting, researchers from academia, government laboratories, and industry from around the world meet to present and discuss recent and future trends in these technologies.
 
 
 
[![](https://assets.underline.io/uploads/markdown_image/1/image/4bdf4450aa93073cd684b096b403df2e.png)](https://drive.google.com/file/d/1CPaA3-Yf7_maBxJMUJaUORLF3HGO9CIe/view?usp=sharing) [![](https://assets.underline.io/uploads/markdown_image/1/image/cea8a407085dee5422a2c16738ce27ca.png)](https://eipbn.org/abstracts/2021/)

To register for this event, please follow the link below.

Our goal is to demonstrate a process flow for TSV (nozzle) on one end and another opening (reservoir) on the other end of an SOI. This silicon die will be used as a micro chemical vapor deposition (CVD) chamber, which is a critical component in the nanoscale additive writing process.

Fabrication of Micro Chemical Vapor Deposition Chamber by Dry dry Deep Silicon and Metal-Assisted Etching Techniques

We developed a versatile room-temperature metal printing technique based on polymer-assisted photochemical deposition (PPD). We demonstrate printing of metal structures with feature sizes as small as 5µm on various substrates, and prove the concept of creating metal-based color filter using PPD.

Additive Manufacturing towards Color Printing via Polymer-Assisted Photochemical Deposition of Metal Thin Films

The heavy metals are poisonous due to inability to decompose and bioaccumulation hence, among the cost well-known environmental pollutant.  Fluorescent based approach has gained considerable attention because of real time monitoring. Aiming at developing an ideal fluorescent sensing platform for heavy metals we synthesized bimetallic MOF for the first time.

Fabrication of luminescent metal-organic framework for optical detection of heavy metals

Here we demonstrate a new type of magnetically responsive nanostructure consisting of a polydimethylsiloxane (PDMS) nanopillar array with deposited nickel caps, that has successfully achieved such decoupling with multiple cap-geometry designs for a better actuation control.

Magnetically Responsive Polymer Nanopillars with Nickel Cap

we have proposed a hybrid machine learning system that presents the optimum materials and process conditions for direct nanoimprint.　The system applied for optimization of Glycol concentration to PVA for low temperature process and the results agree with experiments.

Process and material design using hybrid machine learning for direct thermal nanoimprint

New resists are required to advance the nanoelectronics industry to keep up the demands of Moore’s law. A new class of high dry etch selectively electron beam resist materials have been developed that are based on a family of heterometallic rings.

Improving the Sensitivity of Metallic Organic Resists

Maskless Grayscale lithography is a key technology to create structured surfaces in photoresist, especially for micro-optic applications. Processes of low-contrast positive resist are well known and used for thicknesses up to 60 µm. The possibility to fabricate higher structures, i.e. 80 µm, 100 µm high and beyond, are of great interest in the micro-optic world. With some double- and triple-coated layers of an experimental resist, we could make structures 83µm and 100µm tall. The triple- coated layer showed some limitations that we plan to overcome to go beyond 100µm.

Improvements on Maskless Grayscale Lithography in thick positive photoresist

In this work, we present a systematic investigation of plasma etching of Cr2O3 films via an inductively coupled plasma-reactive ion etching system in nanoscale. The effects of plasma composition, rf-chuck power and ICP source power on the etch rates, sidewall profile, surface roughness, selectivity and dc-bias have been systematically investigated.

Patterning of Chromium Oxide (Cr2O3) as a Hard Mask by Plasma Etching

We characterize in-situ the impact of aberration-corrected electron-beam lithography (AC-EBL) on the performance of suspended graphene field-effect transistors. When AC-EBL is performed on the vicinity of a graphene channel, detrimental effects can be removed by vigorous annealing, while the damage caused by AC-EBL performed directly on a channel is irreversible.

In-situ Study of the Impact of Aberration-Corrected Electron-Beam Lithography on the Electronic Transport of Suspended Graphene Devices

Massively-parallel electron-beam systems are developed to improve the writing throughput.  Two different methods to further decrease the writing time are investigated, i.e., reducing the maximum dose difference in a feature and utilizing empty cycles (with no beam on) in the conventional writing methods.

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A modular 100 keV vacuum sealed FEG

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Fabrication of Micro Chemical Vapor Deposition Chamber by Dry dry Deep Silicon and Metal-Assisted Etching Techniques

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