United States

PMMA exposure sensitivity to both electrons and gallium ions at identical conditions was measured. It was found that a positive sensitivity to gallium ions is 1000 times higher than to electrons, all at the same conditions. Original procedure allowed to measure ion contrast (~3) for highly nonuniform in depth exposure

EIPBN 2021

 Ion beam lithography: sensitivity/contrast in IBL vs EBL.

contrast

sensititvity

pmma resist

ion beam lithography

[![](https://assets.underline.io/uploads/markdown_image/1/image/81a3c0317d24f663b49b996875024d45.png)](https://aclanthology.org/volumes/2022.coling-1/)



### THE CONFERENCE WE KNOW AND WE WANT.
**COLING**, the International Conference on Computational Linguistics, is one of the premier conferences for the natural language processing and computational linguistics.

First established in 1965, the biennial COLING conference is held in diverse parts of the globe and attracts participants from both top-ranked research centers and emerging countries. Today, the most important developments in our field are taking place not only in universities and academic research institutes but also in industrial research departments including tech-startups. COLING provides opportunities for all these communities to showcase their exciting discovery.

In fall of 2022, COLING will be held in Gyeongju in a hybrid format. All participants can either present at the venue site or join virtually. As more people get vaccinated, we are happy to provide safer environments for our colleagues. We believe that COLING 2022 will be one of the conferences, free from the pandemic. The hybrid format gives presenters and sponsors a valuable opportunity to promote their companies in both an online and in-person venue. For the first time in a long time, customers can interact with their sponsor's products first-hand. The online venue, too, gives sponsors the chance to network with those unable to attend the in-person session.

The hybrid format ultimately lends itself to greater exposure for our sponsors: COLING2022 will let you reach more potential partners and customers than ever before!

To gain access to this event page you are required to register. Find more information and pay the registration fee on event the organizer’s website **[https://coling2022.org/reg](https://coling2022.org/reg)**

COLING 2022

COLING, the International Conference on Computational Linguistics, is one of the premier conferences for the natural language processing and computational linguistics.

poster

The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as "3-Beams," is the premier gathering of scientists and engineers who are dedicated to electron, ion and photon lithography, imaging, and analysis; atomically precise fabrication; nanofabrication process technologies and related emerging technologies; and their applications in a broad spectrum of fields. In its 64th meeting, researchers from academia, government laboratories, and industry from around the world meet to present and discuss recent and future trends in these technologies.
 
 
 
[![](https://assets.underline.io/uploads/markdown_image/1/image/4bdf4450aa93073cd684b096b403df2e.png)](https://drive.google.com/file/d/1CPaA3-Yf7_maBxJMUJaUORLF3HGO9CIe/view?usp=sharing) [![](https://assets.underline.io/uploads/markdown_image/1/image/cea8a407085dee5422a2c16738ce27ca.png)](https://eipbn.org/abstracts/2021/)

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We introduce a UV greyscale lithography process combining large surface patterning with a high vertical resolution. To reach a low contrast curve slope, we studied the annealing processes Soft Bake and Post Exposure Bake. We also achieve a 50nm Si steps within our presented plasma etching process.

Optimized UV grayscale process for high vertical resolution applied to spectral imagers

We  optimized the built-in lens mask (BILM) which was shown to be able to form a three-dimensional image in a single exposure by using its multiple focus function, in order to creat the ideal target shape.

Optimization of the Built-in Lens Mask for Three-Dimensional Photo Lithography

The goal of this work is to build compartmentalized microelectrode arrays to assess the impact of conditioned cell culture media exchange between two initially isolated neuronal networks. The fabrication of biocompatible dual-chamber microelectrode arrays is presented, including the manufacturing and attachment of resin rings with controllable openings for fluid exchange.

A dual-chamber microelectrode array to facilitate neuronal network communication

Width/depth and shape of volume of resist modified by ion beam as function of ion energy, exposure time and ion mass (He, Ne, Ar, Ga, Kr, Xe и Rn) is investigated by Monte-Carlo simulation. Sub-10nm resolution is found and confirmed. Analytical interpolating expressions for arbitrary ion mass, energy are submitted

 Ion beam lithography: resist modification volume determination and sub-10nm resolution prediction via simulation

In spite of M-C simulation shows strong dependence proximity function on depth (3D-PF)  it is possible to find effective α, β, η parameters for two-dimensional PF using original algorithm which considers development. Good agreement with experimental data is demonstrated thus proximity parameters now can be calculated for arbitrary layered material

PRESENTATION OF PROXIMITY FUNCTION BY THREE PARAMETERS , , BASED ON MONTE CARLO METHOD AND COMPARISON WITH EXPERIMENT

Two-Photon Grayscale Lithography (2GL®) is a breakthrough innovation uniting the strengths of grayscale lithography with the precision and flexibility of Two-Photon Polymerization (2PP). This merger results in an enormous design freedom inherited from 2PP-based additive manufacturing and at the same time costeffective microfabrication of 2.5-dimensional topographies with optical-quality surfaces.

Two-photon grayscale lithography

It is often thought that cleaving can only be applied to crystalline materials such as silicon and GaAs and that it is an inherently dirty and imprecise process. Dicing by cleaving can be applied to a wide variety of wafer substrates including silicon, sapphire, GaAs, GaN, InP, SiC,  and glass.

Wafer dicing by cleaving: A fast, clean, dry and accurate

Zyvex Labs has been working to convert a Scanning Tunnelling Microscope into an Atomic-Precision Lithography Tool. We describe the various advances in STM hardware and control systems that go into making this leap.

From STM to Lithography Tool

High fidelity 2D and 3D micro and nanometer structures are facilitated by a number of fabrication methods which employ numerous concepts of lithographic patterning. In our contribution we seek to review our material innovations for scientific work where emerging nanofabrication is employed as well advanced production with industrial relevance.

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Ion beam lithography: sensitivity/contrast in IBL vs EBL.

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Optimized UV grayscale process for high vertical resolution applied to spectral imagers

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