United States

We introduce a UV greyscale lithography process combining large surface patterning with a high vertical resolution. To reach a low contrast curve slope, we studied the annealing processes Soft Bake and Post Exposure Bake. We also achieve a 50nm Si steps within our presented plasma etching process.

EIPBN 2021

Optimized UV grayscale process for high vertical resolution applied to spectral imagers

spectral imagers.

fabry-perot interferometers

grayscale lithography

The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as "3-Beams," is the premier gathering of scientists and engineers who are dedicated to electron, ion and photon lithography, imaging, and analysis; atomically precise fabrication; nanofabrication process technologies and related emerging technologies; and their applications in a broad spectrum of fields. In its 64th meeting, researchers from academia, government laboratories, and industry from around the world meet to present and discuss recent and future trends in these technologies.
 
 
 
[![](https://assets.underline.io/uploads/markdown_image/1/image/4bdf4450aa93073cd684b096b403df2e.png)](https://drive.google.com/file/d/1CPaA3-Yf7_maBxJMUJaUORLF3HGO9CIe/view?usp=sharing) [![](https://assets.underline.io/uploads/markdown_image/1/image/cea8a407085dee5422a2c16738ce27ca.png)](https://eipbn.org/abstracts/2021/)

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poster

We present optically resonant bipartite metal nano-cylinder arrays fabricated using electron beam lithography. The arrays utilise two different structure sizes with diameter differences as small as 10 nm. We show that this can be achieved and that the arrays show a resonance response that agrees with electromagnetic simulations.

The Fabrication of Bipartite Plasmonic Arrays for Lasing Applications

We demonstrated a technology to experimentally investigate plasmon enhanced fluorescence at the sub-nanometer scale, where strong fluorescence quenching occurs. We have experimentally identified optimal gap sizes for maximum plasmon enhanced fluorescence with tunable dielectric spacers.

Probing the Mechanisms of Strong Fluorescence Enhancement in Plasmonic Nanogaps with Subnanometer Precision

The fabrication of large area silver nano-gratings has been reported using optical interference lithography. The coupling of these plasmonic resonators with optically active quantum dots indicates significant enhancement in photoluminescence signal. Furthermore, The coupling with WS2 monolayers and MoS2/WS2 hetro-bilayers to enhance photocatalytic hydrogen conversion will also be discussed.

Nanofabricated Plasmonic Resonators on Optically Active Materials for Hydrogen Photocatalysis

We describe a closed-loop method for patterning liquid samples using Dip-Pen Nanolithography. The proposed work addresses a pervasive issue in scanning probe lithography, namely real-time closed-loop control over patterning, and scanning probe lithography of liquids as a candidate for the robust nanoscale manipulation of liquids for advanced high throughput chemistry.

Closed-Loop Nanopatterning of Liquids with Dip-Pen Nanolithography

Theoretical and practical aspects of NEG pumps technology will be presented, with particular focus on the unique benefits in electron microscopy and e-beam lithography: the extreme compactness; the possibility to transport the gun under vacuum in total absence of power; the extended source lifetime.

Features & Benefits of NEXTorr® pumps in e-beam systems

Two-Photon Grayscale Lithography (2GL®) is a breakthrough innovation uniting the strengths of grayscale lithography with the precision and flexibility of Two-Photon Polymerization (2PP). This merger results in an enormous design freedom inherited from 2PP-based additive manufacturing and at the same time costeffective microfabrication of 2.5-dimensional topographies with optical-quality surfaces.

Two-photon grayscale lithography

It is often thought that cleaving can only be applied to crystalline materials such as silicon and GaAs and that it is an inherently dirty and imprecise process. Dicing by cleaving can be applied to a wide variety of wafer substrates including silicon, sapphire, GaAs, GaN, InP, SiC,  and glass.

Wafer dicing by cleaving: A fast, clean, dry and accurate

Zyvex Labs has been working to convert a Scanning Tunnelling Microscope into an Atomic-Precision Lithography Tool. We describe the various advances in STM hardware and control systems that go into making this leap.

From STM to Lithography Tool

High fidelity 2D and 3D micro and nanometer structures are facilitated by a number of fabrication methods which employ numerous concepts of lithographic patterning. In our contribution we seek to review our material innovations for scientific work where emerging nanofabrication is employed as well advanced production with industrial relevance.

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Next from EIPBN 2021

The Fabrication of Bipartite Plasmonic Arrays for Lasing Applications

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