### Welcome to IEEE NCA 2022!

NCA 2022, the International Symposium on Network Computing and Applications, is a successful series of conferences that serves as a large international forum for presenting and sharing recent research results and technological developments in the fields of Network and Cloud Computing. NCA, which is sponsored by the IEEE Computer Society, reaches out to both researchers and practitioners, and to both academia and industry. The conference features keynotes, technical presentations, and workshops.

All papers presented at the main conference and the workshops will be submitted to IEEE Xplore for publication and indexing.

[More about NCA](https://www.nca-ieee.org/2022/index.html)

**Organization**

* Steering Committee Chair: Dimiter R. Avresky, *IRIANC, Boston/Munich, USA/Germany*
* General Chair: Michele Colajanni, *University of Bologna, Italy*
* Program Chair: Miguel Pardal, *INESC-ID, Lisboa, Portugal*
* Program Chair: Luca Ferretti, *University of Modena and Reggio Emilia, Italy*
* Financial Chair: Mauro Andreolini, *University of Modena and Reggio Emilia, Italy*

**The topics of interest include, but are not limited to:**

* Theory of Network Computing
* Autonomic Network Computing
* Content Delivery Network (CDN)
* High Speed Networks/Protocols and Middleware
* Routing Mechanisms
* Overlay Networks/Peer-to-Peer Systems
* System Area Networks (SAN)/Clusters
* Performance Modeling/Quality of Services (QoS) Issues
* Web Caching and Switching
* Dependable Wide, Local, and System Area Networks
* Network Security
* Intrusion-Tolerant Networked Systems
* Scalable and Dependable Servers and Data Centers
* Middleware for Dependable Network Computing
* Self* (Configuring, Healing, Optimizing, Protecting, Organizing, Aware)
* Platforms for Network Computing
* Network Protocols: Verification and Validation
* Autonomic Network Computing for Achieving Self* Properties and Applications Availability
* Seamless and Virtual Capabilities for Implementing Self* Properties
* Software Defined Networking (SDN): Principles and Implementation
* Designing Highly-Available and Secure SDN
* Network Functions Virtualization (NFV): Design and Optimization
* Network Cloud Computing
* Machine Learning Techniques for Cloud Resources Management
* Big Data in Clouds for IoT
* Future Internet and Communicating Objects
* Mobile Ad-Hoc Networks (MANET)
* Sensor Networks
* Fog/Edge Computing
* Energy-Efficient Computation and Communication
* Applications to Real and/or Complex Problems, Practical Experiences and Prototypes
* Programming Environments for Distributed Systems
* Blockchain
* Byzantine Fault Tolerance
* Web and Mobile Security
* Security of Networked Applications (including Automotive, Industrial and Cyberphysical Systems)


To access the IEEE NCA 2022 content, [please register here ](https://www.nca-ieee.org/2022/registration.html)

IEEE NCA 2022

NCA 2022, the International Symposium on Network Computing and Applications, is a successful series of conferences that serves as a large international forum for presenting and sharing recent research results and technological developments in the fields of Network and Cloud Computing.

The 14th MRAM Global Innovation Forum is a one-day forum organized the day following IEDM in San Francisco. The Forum consisted of 11 invited talks from leading experts and a panel discussion. Various MRAM related topics were covered including STT-MRAM technology, memory and processor demonstrations, SOT-MRAM, and the needs, challenges and potential of MRAM. The Forum was originally initiated by Samsung Semiconductor, and this forum marks the 14th edition of the series.

**Program committee:**<br>
Jean-Anne Incorvia (Texas University, USA)<br>
Daniel Worledge (IBM Research, USA)<br>
Luc Thomas (Applied Materials, USA)<br>
Kyung-Jin Lee (Korea Univ., South Korea)<br>
Shunsuke Fukami (Tohoku University, Japan)<br>
Jordan Katine (Western Digital, USA)<br>
Jack Guedj (Numem, USA)<br>
Bernard Dieny (SPINTEC, France)<br>
Kevin Garello (SPINTEC, France)<br>

**Acknowledgements:**<br>
This Forum is the 14th of a series initiated by Samsung Semiconductor in 2013. It is supported by Samsung Semiconductor through a donation to the IEEE Magnetics Society. The whole Society deeply thanks Samsung for this generous sponsorship.<br>

Phyllis Mahoney and coworkers are sincerely acknowledged for their help with the Forum organization.<br>




To gain access to this event page you are required to register. 

Please register [here](https://forms.gle/rgp1Db8wpdywefTFA).



IEEE IEDM 2022 - MRAM Forum

The 14th MRAM Global Innovation Forum is a one-day forum organized the day following IEDM in San Francisco. The Forum consisted of 11 invited talks from leading experts and a panel discussion. Various MRAM related topics were covered including STT-MRAM technology, memory and processor demonstrations, SOT-MRAM, and the needs, challenges and potential of MRAM. The Forum was originally initiated by Samsung Semiconductor, and this forum marks the 14th edition of the series.

## Welcome to EMNLP 2022!
I am delighted to welcome you to EMNLP 2022!  I believe this conference has been complicated beyond any precedent.  Over the past year, it’s been thrilling to see the organization team approach each new puzzle with creativity and enthusiasm.  We hope that those participating in Abu Dhabi as well as those joining remotely will leave the conference feeling newly inspired by the program and newly connected to our ever-growing community.  Following EMNLP 2021 and major NLP conferences since, EMNLP 2022 is “hybrid,” serving both virtual and in-person participants.

Our key innovations for EMNLP 2022 include:

* EMNLP 2022 is “hybrid” in a second sense, as well:  we allowed both direct and rolling review paper submissions, building on the pilot experiment of EMNLP 2021, which considered a small number of ARR submissions. 
* Familiar from NAACL but new to EMNLP, we’ve added an industry track.
* During the conference, “portals” will link virtual poster sessions to in-person conference participants during poster sessions each day.
* The first ACL-family conference in the United Arab Emirates.

<br>*Message from Noah A. Smith, University of Washington and Allen Institute for AI, Seattle, Washington, USA*<br>
***EMNLP 2022 General Chair***
<br><br><br>
[![](https://s3.eu-west-1.amazonaws.com/underline.prod/uploads/markdown_image/1/image/9eec7d4a287ee18c278b08229290aa83.png)](https://drive.google.com/file/d/1OlPv6QBeo62VVTughj2jkiLeyHd1WnUt/view)
<br><br>
[![](https://s3.eu-west-1.amazonaws.com/underline.prod/uploads/markdown_image/1/image/a3db7a768409f05192210d98601edb25.png)](https://emnlp2022.rocket.chat/)



To access this site you need to register. Please register [here](https://2022.emnlp.org/registration/).

Register here

EMNLP 2022

Welcome!
EMNLP 2022 will take place in Abu Dhabi from December 7th to December 11th, 2022. And it will be held in hybrid mode, both online and offline.

**Short Course 1:  High-Performance Technologies for Datacenter and Graphics to enable Zetta Scale Computing**

<button Download the Proceedings="button" onclick="window.open('https://xpresspubs.org/iedm22/','blank')">**Download the Proceedings**</button>

Course Organizer: Ruth Brain, Intel

The Path to Zettascale, *Wilfred Gomes, Intel*<br>
Energy-Efficient CMOS scaling for 1nm and beyond, *Daewon Ha, Samsung*<br>
Novel Logic devices for Energy Efficient Computing, *Iuliana Radu, TSMC*<br>
Heterogenous integration and Chiplet packaging, *Subramanian Iyer, UCLA*<br>
Process Architectures Changes To Improve Power Delivery, *Geert Hellings and Gaspard Hiblot, imec*<br>
Optical Interconnects, Vladimir Stojanovic, *University of California, Berkeley*<br>

To gain access to this event page you are required to register. 

Please register [here](https://www.ieee-iedm.org/registration-overview).

IEEE IEDM 2022 - SHORT COURSE I

Short Course 1:  High-Performance Technologies for Datacenter and Graphics to enable Zetta Scale Computing


**Short Course 2: Next-Generation High-Speed Memory for AI and High Performance Compute**

<button Download the Proceedings="button" onclick="window.open('https://xpresspubs.org/iedm22/','blank')">**Download the Proceedings**</button>

Course Organizer:  Eric Wang, TSMC

Memory solutions for HPC & AI: An Overview, John Wuu, *AMD*<br>
High-speed SRAMs for Future HPC and AI, *Hidehiro Fujiwara, TSMC*<br>
Next-Generation DRAM for HPC and AI, Kyomin Sohn, *Samsung*<br>
Future Prospect of In- and Near-Memory Computing, Naveen Verma, *Princeton*<br>
High-Speed Emerging Memories for AI and HPC, Shimeng Yu, *Georgia Institute of Technology*<br>
Innovative 3D Technologies for Memory-Compute Integration, Geert Van der Plas, *imec*<br>

IEEE IEDM 2022 - SHORT COURSE II

Short Course 2: Next-Generation High-Speed Memory for AI and High Performance Compute

<button Download the Proceedings="button" onclick="window.open('https://xpresspubs.org/iedm22/','blank')">**Download the Proceedings**</button>


The tutorials are in their 13th year and are stand alone presentations on specialized topics taught by world-class experts. These tutorials will provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. In contrast, the traditional short courses are focused on a single technical topic.

**1. FEOL reliability: From Essentials to Advanced and Emerging Devices and Circuits, Ben Kaczer, *imec***<br>
**2. Enabling Nanofabrication and 3D Integration Technologies for the Semiconductor Industry, Qiangei Xia, *University of Massachusestts***<br>



IEEE IEDM 2022 - TUTORIALS 1+2

The tutorials are in their 13th year and are stand alone presentations on specialized topics taught by world-class experts. These tutorials will provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. In contrast, the traditional short courses are focused on a single technical topic.

<button Download the Proceedings="button" onclick="window.open('https://xpresspubs.org/iedm22/','blank')">**Download the Proceedings**</button>


The tutorials are in their 13th year and are stand alone presentations on specialized topics taught by world-class experts. These tutorials will provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. In contrast, the traditional short courses are focused on a single technical topic.

**3. Resistive Memories-Based Concepts for Neuromorphic Computing, Elisa Vianello, *CEA Leti***<br>
**4. The Era of Advanced Packaging and Hybrid Bonding, Sitaram Arkalgud, *Tokyo Electron Ltd.***<br>

IEEE IEDM 2022 - TUTORIALS 3+4

<button Download the Proceedings="button" onclick="window.open('https://xpresspubs.org/iedm22/','blank')">**Download the Proceedings**</button>


The tutorials are in their 13th year and are stand alone presentations on specialized topics taught by world-class experts. These tutorials will provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. In contrast, the traditional short courses are focused on a single technical topic.

**5. Innovations and Technologies for 2nm CMOS and Beyond, Tenko Yamashita, *IBM***<br>
**6. Integrating microfluidics and electronic chips. Technologies for in vitro and in vivo clinical diagnostics, Carolotta Guiducci, *EPFL***<br>

IEEE IEDM 2022 - TUTORIALS 5+6

The tutorials are in their 13th year and are stand alone presentations on specialized topics taught by world-class experts. These tutorials will provide a brief introduction to their respective fields, and facilitate understanding of the technical sessions. In contrast, the traditional short courses are focused on a single technical topic.


### Welcome to the 68th Annual IEEE International Electron Devices Meeting!

<button Download the Proceedings="button" onclick="window.open('https://xpresspubs.org/iedm22/','blank')">**Download the Proceedings**</button>

IEDM 2022 will be in-person conference December 3-7, 2022 at the Hilton San Francisco Union Square. Starting December 12, the full conference will be available on-demand.

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

[**Welcome Message from Barbara De Salvo, 2022 IEEE IEDM General Chair**](https://drive.google.com/file/d/1qaWZ49Qy3LiZwfDRV4QPXuxpf6ziRXO8/view?usp=sharing) 


To gain access to this event page you are required to register. 

Please register [here](https://www.ieee-iedm.org/registration-overview).


IEEE IEDM 2022 - Main Conference

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

The AACL, Asia-Pacific Chapter of the Association for Computational Linguistics, and the AFNLP, Asian Federation of Natural Language Processing, invite you to participate in the 1st Conference of the Asia-Pacific Chapter of the Association for Computational Linguistics (AACL) and the 10th International Joint Conference on Natural Language Processing (IJCNLP). 
<br>
<br>

A registration is required to access this event. Access to the event site will be granted to all registered attendees on **November 16th**. If you have not already done so, please register using the link below:
<br>
<br>https://conference.iis.sinica.edu.tw/servlet/Register?ConferenceID=411

Registration Is Required

2022 AACL-IJCNLP

The AACL, Asia-Pacific Chapter of the Association for Computational Linguistics, and the AFNLP, Asian Federation of Natural Language Processing, invite you to participate in the 1st Conference of the Asia-Pacific Chapter of the Association for Computational Linguistics (AACL) and the 10th International Joint Conference on Natural Language Processing (IJCNLP). 