Lecture image placeholder

Premium content

Access to this content requires a subscription. You must be a premium user to view this content.

Monthly subscription - $9.99Pay per view - $4.99Access through your institutionLogin with Underline account
Need help?
Contact us
Lecture placeholder background
VIDEO DOI: https://doi.org/10.48448/c2y8-w680
PAPER DOI: 10.1109/IRPS48228.2024.10529381

technical paper

IRPS 2024 Main Conference

April 18, 2024

Dallas, United States

2.5D/3D Packaging and Reliability: New Frontiers, Old Paradigms, and Opportunities

Please log in to leave a comment

Downloads

SlidesPaperTranscript English (automatic)

Next from IRPS 2024 Main Conference

Statistical characterization of off-state stress degradation in planar HKMG nFETs using device arrays
technical paper

Statistical characterization of off-state stress degradation in planar HKMG nFETs using device arrays

IRPS 2024 Main Conference

+4Javier Diaz FortunyErik BuryPablo Saraza-Canflanca
Pablo Saraza-Canflanca and 6 other authors

18 April 2024

Stay up to date with the latest Underline news!

Select topic of interest (you can select more than one)

PRESENTATIONS

  • All Lectures
  • For Librarians
  • Resource Center
  • Free Trial
Underline Science, Inc.
1216 Broadway, 2nd Floor, New York, NY 10001, USA

© 2023 Underline - All rights reserved