Lecture image placeholder

Premium content

Access to this content requires a subscription. You must be a premium user to view this content.

Monthly subscription - $9.99Pay per view - $4.99Access through your institutionLogin with Underline account
Need help?
Contact us
Lecture placeholder background

technical paper

IRPS 2022

March 28, 2021

Dallas, TX, United States

Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging

Please log in to leave a comment

Downloads

SlidesTranscript English (automatic)

Next from IRPS 2022

Soft Error Characterization for 5-nm Bulk FinFET Technology  in Terrestrial Enviroment
technical paper

Soft Error Characterization for 5-nm Bulk FinFET Technology in Terrestrial Enviroment

IRPS 2022

+8Yoni Xiong
Yoni Xiong and 10 other authors

28 March 2021

Stay up to date with the latest Underline news!

Select topic of interest (you can select more than one)

PRESENTATIONS

  • All Lectures
  • For Librarians
  • Resource Center
  • Free Trial
Underline Science, Inc.
1216 Broadway, 2nd Floor, New York, NY 10001, USA

© 2023 Underline - All rights reserved