United States

Power design engineers want simplicity and the maximum degrees of freedom in making choices for the design challenges they face every day. They don’t want transistor suppliers to predefine the operation of a circuit in ways that may limit their approach to maximizing performance. Power designers want to innovate, optimize and not be constrained. There will always be a need for a mix of discrete, multi-chip packages, and power module form factors in order to meet the growing number and variety of GaN applications.

IEEE WiPDA 2021

One Size Doesn&#39;t Fit All - The Need for Multiple Approaches to GaN Circuit Design

The IEEE Workshop on Wide Bandgap Power Devices & Applications (WiPDA) provides a forum for device scientists, circuit designers, & application engineers from the Power Electronics & Electron Devices Societies to share technology updates, research findings, experience & potential applications.

**Topics of interest**

* Heteroepitaxial & Bulk Materials Growth
* Gate Dielectrics & Surface Passivation
* Device Structures & Fabrication Techniques
* Device Characterization & Modeling
* Very-High Efficiency or Compact Converters
* Safe Operating Areas of Wide Bandgap Devices, Including Short Circuit, Spike, & Transient Tolerance
* Harsh Environment (High Temperature) Operation & Reliability
* Packaging Power Modules & ICs
* Hard-Switched & Soft-Switched Application Analysis
* Gate Drive & Other Auxiliary Circuits
* High-Performance Passive Components
* Applications in Renewable Energy & Energy Storage, Transportation, Industrial Drives, & Grid Power Systems
* Wide Band Gap System Design Philosophies & Strategies
* Radio Frequency (RF) GaN (New)
* Technology Roadmap of Wide Bandgap Including Devices, Applications and Packaging (New)

### Please select the button below to view and download the session papers. The Virtual Proceedings PDF can be downloaded [here.](https://drive.google.com/file/d/171y2_u63V-pc9-bC-eZgHLzJou2oCfST/view?usp=sharing)

[![](https://assets.underline.io/uploads/markdown_image/1/image/c8e1b0a2881d3bb0a75ece4761f43c9f.png)](https://drive.google.com/drive/folders/1GWEFLzH6K4aUBaJiBFJDw4x9sKLTl6-g?usp=sharing)


This event requires a registration to attend, please register [here](https://web.cvent.com/event/536cea3d-4c0d-4d50-8939-529979d80785/summary) to purchase a ticket. 

The IEEE Workshop on Wide Bandgap Power Devices & Applications (WiPDA) provides a forum for device scientists, circuit designers, & application engineers from the Power Electronics & Electron Devices Societies to share technology updates, research findings, experience & potential applications.

One Size Doesn't Fit All - The Need for Multiple Approaches to GaN Circuit Design

keynote

This presentation shows a liquid metal-based cooling system for power converters with an inductor integrated magnetohydrodynamic (MHD) pump. The inductor in this case not only functions as the pump for liquid metal but also can be an essential part of typical power converters such as the output inductor of a buck converter. Two prototypes of liquid metal-based cooling systems were designed and built. The first prototype is an MHD pump with an external current source and permanent magnets and to evaluate the effectiveness and power consumption of liquid metal-based cooling. The second prototype for the first time integrates the MHD pump into an inductor, which eliminates the need for an external power supply and permanent magnets. Since the inductor is part of the power converter to be cooled, the flow rate can be self-adjusted with the load condition. Simulation and experimental results validate the concept of the inductor integrated liquid metal pump and demonstrate the advantage of the liquid metal cooling system over non-metallic fluid-based liquid cooling systems in terms of power density, cooling efficiency, power consumption, reduction of rotatory components, and lowered acoustic noise.

Liquid Metal based Cooling for Power Electronics Systems with Inductor Integrated Magnetohydrodynamic Pump (MHD Pump)

In this work, electrical parameters of silicon carbide MOSFETs and their temperature dependency, as well as their electrical behavior over time are investigated. An approach is presented to make assertions about the condition of the
transistors during operation through the measurement of multiple temperature and degradation-sensitive electrical parameters. The on-state voltage, peak gate current and quasi-threshold voltage are monitored through dedicated acquisition circuits. An exemplary AC power cycling setup which combines switching and conduction losses while applying nominal DC-link voltage is used to characterize the parameters in operation. The setup consists of two half-bridge modules with measurement circuitry connected directly to the devices under test. Results show the capability
of the proposed circuits to measure parameters carrying temperature and health information in normal operation. A high linearity of the quasi-threshold voltage in regards to the junction temperature is found, with a relative temperature sensitivity in the per mille range, comparable to the sensitivity of the on-state resistance. No significant temperature sensitivity is found for the peak gate current, due to the specific gate driver design.

Characterization of Electrical Parameters for Health Monitoring in SiC MOSFETs During AC Power Cycling

LLC converters are the most popular isolated dc/dc converter with high efficiency power conversion and simple control strategy. To facilitate the designand optimization of LLC converters, in this article, we investigate the circuit and power loss models. The high accuracy of the circuit and power loss models are ensured by adopting time domain modelling. The power loss model is developed solely based on the manufacture provided datasheets with convenient yet effective evaluation of components performances. A simulation and design tool is built to further facilitate the evaluation of the LLC converters. Experimental results from a 500 W symmetric half-bridge LLC converter are presented and compared with the theoretical analysis results to validate the accuracy and effectiveness of the developed models.

Experimental Validations of the SiC MOSFET based LLC Converter Circuit and Power Loss Models

The use of wide bandgap (WBG) devices in the dominant voltage-source inverters (VSIs) creates more challenging conducted common-mode (CM) electromagnetic interference (EMI) issues. Traditional way of suppressing CM EMI is by adding external filters. However, the added filter can add significant mass and volume to the inverter. The use of existing current-source inverter (CSI) can help relieve the CM EMI issue, but WBG-CSI’s EMI profile still exceeds EMI standards. In this paper, two new balanced current-source inverter (CSI) topologies are proposed that provide several advantages over the standard VSIs or existing CSI topology when using WBG power switches. For both balanced CSI topologies, the use of additional three switches generate a second common-mode voltage (V_cm) component that forces the total V_cm of both inverters to be close to zero. This significantly reduces the inverters’ conducted CM EMI. Moreover, the proposed H10-Balanced-CSI topology combined with its modulation scheme make its CMV cancellation insensitive to propagational delay distortions among its switches.

A Balanced Current-Source Inverter and its dc-Link Shunted Variant for Common-Mode Voltage Cancellation

This paper presents the design and development of a Silicon Carbide (SiC) technology-based Non-Inverting Buck-Boost (NIBB) DC-DC power conversion unit for harsh space environment application with very high temperature (HT) (>300oC) and high radiation level. This work evaluates the capability of SiC devices, comprising of LDMOSFET (Lateral Diffused MOSFET) for high temperature (>300oC) power electronics. The temperature-dependent characterization of relevant switching device parameters such as channel resistance, device junction capacitances is performed through device modeling and simulations. The selection of critical passive components of the power converter is done through rigorous characterization of their performance metrics such as capacitance, inductance, leakage current, etc. under influence of increasing operating temperature. In this work, we designed and fabricated a proof-of-concept of NIBB DC-DC converter using the fabricated SiC MOSFETs that are demonstrated to operate at 300 °C ambiance. It is designed to provide a 15A output load and convert the input side battery voltage levels of 28V, 120V, and 160V to a configurable output voltage from 30V to 48V, used as the standard for NASA space missions. Results at 300oC environment report a peak efficiency of 92.5% at 450W load and 100kHz switching frequency, which validates the developed converter architecture to be a suitable candidate for high-frequency HT power conversion.

High Temperature Application of a SiC-Ldmosfet Based DC-DC Power Converter

This presentation shows a design of a 10 kV silicon carbide (SiC) MOSFET based modular multilevel converter (MMC). The MMC functions as the interconnection between a 24 kV dc bus and a 13.8 kV distribution grid. This presentation focuses on the hardware design of the MMC and its submodules. The gate driver, auxiliary power supply and bus bur in submodules are major components that need to meet high dv/dt immunity and high insulation voltage requirements. The gate driver achieves over 200 kV/µs common mode transient immunity (CMTI). Its associated auxiliary power supply is based on an on-board transformer with over 30 kV insulation capability and 1.4 pF barrier capacitance. The busbar achieves less than 11 kV/cm electric field in the air to avoid partial discharges. Validation tests of the MMC submodule were performed by double pulse tests at 5 kV and buck converter tests at 3 kV, 52 A (peak). Reliable operations were achieved in validation tests.

Hardware Design of Medium Voltage SiC-based Modular Multilevel Converters for Grid-tied Applications

We investigate the impact of soft- (SS) and hard-switching (HS) transitions on threshold voltage (VTH) and on-resistance (RON) drifts in packaged Silicon Carbide (SiC) MOSFETs. To this end, we present a novel measurement setup that allows, for the first time, the on-the-fly characterization of both VTH and RON during HS mode operation. During measurement, we observed VTH reduction and RON increase under both SS and HS conditions, with significantly higher drifts found in HS. The larger degradation found in HS was ascribed to the additional self-heating induced by the conduction of high currents (IDS) at high voltage during transitions. This hypothesis was demonstrated by connecting a heatsink to the Device Under Test (DUT), thanks to which we highlighted the thermal contributions on the observed drifts.

Impact of Soft- and Hard-Switching transitions on VTH and RON Drifts in packaged SiC MOSFETs

This paper presents a FPGA-based real-time emulator
of silicon carbide (SiC) metal-oxide-semiconductor fieldeffect
transistor (MOSFET) employing dynamic device model.
The threshold-based model utilizes the Shichman and Hodges
equations with voltage-dependent non-linear device capacitances
to obtain an accurate model for the turn-on switching transients
of the device. Accurate dynamic switching behavior including
the key states drain-current, drain-source voltage and gate-source
voltage can be achieved in real-time and monitored with a digital
to analog converter. Such models are beneficial for rapid and costeffective
manufacturing of high-power SiC-based converters. The
simulation results are verified experimentally on a 3.3kV SiC
MOSFET module, showing good correspondence.

Real-Time FPGA Simulation of Silicon Carbide MOSFETs

6.5 kV-rated 4H-SiC MOSFETs have been successfully fabricated and demonstrated on 60 µm-thick, 1.2×1015 cm-3 doped N-type epi-layer on 6-inch, 4H-SiC N+ substrates. Devices were fabricated at the 6-inch SiC foundry, X-FAB, TX, USA. Active and edge termination areas of high voltage (>3.3 kV) SiC devices require critical design consideration due to implant straggles from the low background doping concentration. Despite the fabrication and design challenges, we have demonstrated Ron,sp of 47 mΩ-cm2 with a breakdown voltage of 7.9 kV with a very low leakage current using ring-based edge termination structure. Devices were then diced and packaged in a SUNY Poly’s custom-made package to evaluate short circuit capabilities. Short circuit withstand time of 6.2 µs was recorded from the nominal device, along with 7 µs and 13 µs from the device with narrower JFET width and wider channel length, respectively.

Critical Design Considerations for Static and Dynamic Performances on 6.5 kV 4H-SiC MOSFETs Fabricated in a 6-inch SiC Foundry

The adoption of high voltage GaN on Silicon power devices is accelerating at a rapid pace over the last several years. The key for designers and system insertion has been robust and reliable, easy to interface and design, high performance normally off GaN compatible with multiple controller and driver architectures. With complete control of the core GaN materials and wafer technology as well as manufacturing, Transphorm’s high speed-high efficiency-easy to use SuperGaN FET with a proven field reliability (FIT < 0.4) products provide superior solutions for applications ranging from 30 Watts to 10 kiloWatts, today and already shipping in volume. This talk will review the growing use of GaN in markets like Fast chargers/adapters (lower power) to server, gaming, crypto mining, industrial (mid-high power) to renewables, energy and electric vehicles (high power), targeting 200% year over year growth.

One Size Doesn't Fit All - The Need for Multiple Approaches to GaN Circuit Design

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One Size Doesn't Fit All - The Need for Multiple Approaches to GaN Circuit Design

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Next from IEEE WiPDA 2021

Liquid Metal based Cooling for Power Electronics Systems with Inductor Integrated Magnetohydrodynamic Pump (MHD Pump)

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Study of Voltage Balancing Techniques for Series-Connected Wide-Bandgap Semiconductors Devices

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