VIDEO DOI: https://doi.org/10.48448/avmf-fr11

technical paper

ESSCIRC ESSDERC Educational Events

September 21, 2021

France

multi-technology wafer level integration for RFFE applications

Please log in to leave a comment

Downloads

SlidesTranscript English (automatic)

Next from ESSCIRC ESSDERC Educational Events

Merging PDKs to build a multi-process multi-tier 3D design environment
technical paper

Merging PDKs to build a multi-process multi-tier 3D design environment

ESSCIRC ESSDERC Educational Events

Olivier Billoint
Olivier Billoint and 1 other author

21 September 2021

Similar lecture

Integration of Polycrystalline diamond on top of GaN and Ga2O3 devices for thermal management
technical paper

Integration of Polycrystalline diamond on top of GaN and Ga2O3 devices for thermal management

DRC 2021

Srabanti Chowdhury
Srabanti Chowdhury

21 June 2021

Stay up to date with the latest Underline news!

PRESENTATIONS

  • All Lectures
  • For Librarians
  • Resource Center
  • Free Trial
Underline Science, Inc.
1216 Broadway, 2nd Floor, New York, NY 10001, USA

© 2023 Underline - All rights reserved