United States

Width/depth and shape of volume of resist modified by ion beam as function of ion energy, exposure time and ion mass (He, Ne, Ar, Ga, Kr, Xe и Rn) is investigated by Monte-Carlo simulation. Sub-10nm resolution is found and confirmed. Analytical interpolating expressions for arbitrary ion mass, energy are submitted

EIPBN 2021

 Ion beam lithography: resist modification volume determination and sub-10nm resolution prediction via simulation

modelling

resist

ion lithography

The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as "3-Beams," is the premier gathering of scientists and engineers who are dedicated to electron, ion and photon lithography, imaging, and analysis; atomically precise fabrication; nanofabrication process technologies and related emerging technologies; and their applications in a broad spectrum of fields. In its 64th meeting, researchers from academia, government laboratories, and industry from around the world meet to present and discuss recent and future trends in these technologies.
 
 
 
[![](https://s3.eu-west-1.amazonaws.com/underline.prod/uploads/markdown_image/1/image/4bdf4450aa93073cd684b096b403df2e.png)](https://drive.google.com/file/d/1CPaA3-Yf7_maBxJMUJaUORLF3HGO9CIe/view?usp=sharing) [![](https://s3.eu-west-1.amazonaws.com/underline.prod/uploads/markdown_image/1/image/cea8a407085dee5422a2c16738ce27ca.png)](https://eipbn.org/abstracts/2021/)

To register for this event, please follow the link below.

AIAI 2020 (16th International Conference on Artificial Intelligence Applications and Innovations) should be held in Halkidiki, Greece. Due to current Covid-19 situation the conference will be held virtually. Underline will host a repository of video talks and preserve them for the future. Videos will be released on Underline one day after the conference.

AIAI 2020

poster

We introduce a UV greyscale lithography process combining large surface patterning with a high vertical resolution. To reach a low contrast curve slope, we studied the annealing processes Soft Bake and Post Exposure Bake. We also achieve a 50nm Si steps within our presented plasma etching process.

Optimized UV grayscale process for high vertical resolution applied to spectral imagers

We  optimized the built-in lens mask (BILM) which was shown to be able to form a three-dimensional image in a single exposure by using its multiple focus function, in order to creat the ideal target shape.

Optimization of the Built-in Lens Mask for Three-Dimensional Photo Lithography

The goal of this work is to build compartmentalized microelectrode arrays to assess the impact of conditioned cell culture media exchange between two initially isolated neuronal networks. The fabrication of biocompatible dual-chamber microelectrode arrays is presented, including the manufacturing and attachment of resin rings with controllable openings for fluid exchange.

A dual-chamber microelectrode array to facilitate neuronal network communication

We describe a closed-loop method for patterning liquid samples using Dip-Pen Nanolithography. The proposed work addresses a pervasive issue in scanning probe lithography, namely real-time closed-loop control over patterning, and scanning probe lithography of liquids as a candidate for the robust nanoscale manipulation of liquids for advanced high throughput chemistry.

Closed-Loop Nanopatterning of Liquids with Dip-Pen Nanolithography

Theoretical and practical aspects of NEG pumps technology will be presented, with particular focus on the unique benefits in electron microscopy and e-beam lithography: the extreme compactness; the possibility to transport the gun under vacuum in total absence of power; the extended source lifetime.

Features & Benefits of NEXTorr® pumps in e-beam systems

Two-Photon Grayscale Lithography (2GL®) is a breakthrough innovation uniting the strengths of grayscale lithography with the precision and flexibility of Two-Photon Polymerization (2PP). This merger results in an enormous design freedom inherited from 2PP-based additive manufacturing and at the same time costeffective microfabrication of 2.5-dimensional topographies with optical-quality surfaces.

Two-photon grayscale lithography

It is often thought that cleaving can only be applied to crystalline materials such as silicon and GaAs and that it is an inherently dirty and imprecise process. Dicing by cleaving can be applied to a wide variety of wafer substrates including silicon, sapphire, GaAs, GaN, InP, SiC,  and glass.

Wafer dicing by cleaving: A fast, clean, dry and accurate

Zyvex Labs has been working to convert a Scanning Tunnelling Microscope into an Atomic-Precision Lithography Tool. We describe the various advances in STM hardware and control systems that go into making this leap.

From STM to Lithography Tool

High fidelity 2D and 3D micro and nanometer structures are facilitated by a number of fabrication methods which employ numerous concepts of lithographic patterning. In our contribution we seek to review our material innovations for scientific work where emerging nanofabrication is employed as well advanced production with industrial relevance.

Ion beam lithography: resist modification volume determination and sub-10nm resolution prediction via simulation

Downloads

Next from EIPBN 2021

Optimized UV grayscale process for high vertical resolution applied to spectral imagers

Similar lecture

Ontological Foundations of Modelling Security Policies for Logical Analytics

Stay up to date with the latest Underline news!

PRESENTATIONS

CONFERENCES

COMPANY

RESOURCES