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**Presentation digest / paper:**

https://submissions.mirasmart.com/verify/ISSCC2021/Underline/Innovations/Digest/D07_06.pdf

**Please vote for this presentation on the following link:**

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**Abstract:**

In Paper 7.6, Sony presents a 50.1Mpixel, 4.16µm-pitch, back-illuminated stacked CIS with a pipelined column-parallel kT/C noise-cancelling sample-and-hold circuit and a 14b delta-sigma ADC achieving 1.18e-rms random noise at 250fps. The design splits the pixel signal line to lower the wiring load and increase the operation speed.

IEEE ISSCC Innovation

7.6 - A High-Speed Back-Illuminated Stacked CMOS Image Sensor with Column-Parallel kT/C-Cancelling S&amp;H and Delta-Sigma ADC

7.6 - A High-Speed Back-Illuminated Stacked CMOS Image Sensor with Column-Parallel kT/C-Cancelling S&H and Delta-Sigma ADC

technical paper

Dear attendees,
we would like to remind you that this year's ISSCC has three events on Underline. If you wish to reach ISSCC Education [please click here](https://underline.io/events/78/reception). If you wish to reach ISSCC Exploration [please click here](https://underline.io/events/79/reception). Remember that you need to be registered for other events in order to have access.

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**The International Solid-State Circuits Conference** is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts.

The ISSCC 2021 Technical Program is composed of three sub-conferences: Education, Innovations and Exploration. 
* Innovations consists of 205 outstanding technical papers including 4 plenary and 6 invited industry (“Highlighted Chip Releases”) and Special Events. 
* Education consists of twelve introductory tutorials, and a short course on PLLs, Clocking, and Clock Distribution. 
* Exploration consists of six expert-oriented forums.

The Conference will also feature a variety of special events, available to all attendees: 
* three panels on “What Technologies Will Shape the Future of Computing?”, “Going Remote: Challenges and Opportunities to Remote Learning, Work, and Collaboration”, and “Favorite Circuit Design and Testing Mistakes of Starting Engineers”, and 
* another technical session on “ICs in PandemICs”. In addition, we continue with the “Student Research Preview” and “Making a Career Choice”.

In addition, you will have access to two Demonstration Sessions, for both recorded and “live” sessions of devices described in nearly 50 selected papers.
Many networking options will be available, please use provided links to get access to networking lounges, speakers interview or book displays.

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