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IEEE ISSCC Innovation
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February 13, 2021
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United States
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Presentation digest / paper:
https://submissions.mirasmart.com/verify/ISSCC2021/Underline/Innovations/Digest/D07_01.pdf
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Abstract:
In Paper 7.1, Samsung presents a 1.2Mpixel stacked iToF depth sensor with 4-tap 3.5µm pixels. It uses multiple interleaving to reduce peak current with minimal demodulation contrast (DC) degradation and multi-user interference cancellation by pseudo-random modulation. The design achieves QE of 38% at 940nm, DC of 96% at 100MHz and 80% at 200MHz modulation with a depth noise less than 0.35% at the 2×2 binning.