Scott Lewis, Ph.D is a research fellow at the school of Chemistry, University of Manchester, United Kingdom. Dr. Lewis’s key research includes designing and fabricating unique metal organic resist systems which are exposed using the Extreme Ultra Violet lithography (EUVL) and Electron Beam lithography (EBL) techniques where 8 nm half pitch have been achieved. As the purpose of a resist is to assist in pattern transfer into the underlying substrate, therefore, he has focused on understanding this process by using the aggressive plasma environment seen in dry etching processes today while observing its effects on the metal organic resist. To date dry etch selectivity of 133:1 have been achieved. Dr. Lewis has recently been appointed as a visiting associate at the California Institute of Technology (Caltech). He is the inventor of the ‘SML resist’ that exhibits nano structures with aspect ratios of more than 10:1. His focus is to model the electron scattering behaviour in the resist environment for the production of nanoscale large scale integration of nanosystems. From this, he has formed a spin out company called ‘Sci-Tron Ltd’ at the University of Manchester to provide a platform for the unique resist technology to reach to the market. Prior to joining Manchester, Dr Lewis earned his BENG in Electronic Engineering from Cardiff University, United Kingdom followed by MSc. and Ph.D. degrees. His graduate research studied the effects of the interaction between nanoparticles and I – line radiation when embedded in an electron beam resist material for nanolithography applications.