A Fully Automated Process for Semiconductor Technology Analysis through SEM Cross-Sections


Image stitching describes the process of reconstruction of a high-resolution image by combining multiple images. Using a scanning electron microscope as the image source, individual images will show patterns in a nm dimension, whereas the combined image may cover an area of several mm$^2$. The recovery of the physical layout of modern semiconductor products manufactured in advanced technologies nodes down to 22~nm requires a perfect stitching process with no deviation with respect to the original design data, as any stitching error will result in failures during the reconstruction of the electrical design. In addition, the recovery of the complete design requires the acquisition of all individually layers of a semiconductor device. The layers represent a 3D structure with interconnections defining error limits on the stitching error for each individual scanned image mosaic. An advanced stitching and alignment process is presented, enabling a true geometrical layout recovery in nanoscale dimensions, which is also applied to and evaluated for other use cases from biological applications.

Recovery of 2D and 3D layout information through an advanced image stitching algorithm using scanning electron microscope images

**Session Chairs**: prof. Lorenzo Baraldi, prof. Lorenzo Seidenari


Demo 1: Medical Imaging and Industrial Analysis

demo

ICPR 2020 is the premier international conference on Pattern Recognition, gathering leading researchers from around the world to present their latest achievements in Pattern Analysis and Recognition, applied Artificial Intelligence and Machine Learning. The topic of the year is " Putting Artificial intelligence to work on Patterns". 
For the first time, ICPR has employed a two-round review process similar to journal submissions, with new papers allowed to be submitted in either the first or second round and papers submitted in the first round and not accepted allowed to be revised and re-submitted for second round review. 

In this edition of the **ICPR 2020** Conference, there are 1407 Oral/Poster presentations organized in five Tracks: 
- Artificial Intelligence, Machine Learning for Pattern Analysis; 
- Biometrics, Human Analysis and Behavior Understanding; Computer Vision, Robotics and Intelligent Systems; 
- Document and Media Analysis; and 
- Image and Signal Processing. 

The **ICPR 2020** Main Conference program also includes 7 Keynotes from prominent world-renowned scientists, 8 Tutorials, 28 Demos, 8 Challenges, 2 Panels, as well as an Industry/Sponsor Exhibition. In addition, 41 Workshops on a range of important current and emerging research topics complete the ICPR 2020 program. 


Bernhard Lippmann

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A Fully Automated Process for Semiconductor Technology Analysis through SEM Cross-Sections

Recovery of 2D and 3D layout information through an advanced image stitching algorithm using scanning electron microscope images

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