In this paper, we discuss the limitations of using conventional linearity metrics (i.e., OIP3 and OP1dB) to evaluate the linearity performance of GaN HEMTs for power amplifier (PA) applications. Unlike Silicon and other traditional III-V devices, GaN HEMTs suffer from soft compression, making the use of conventional metrics “unfair” when compared to other transistor technologies. Through simulation-based evaluation of two different commercial GaN devices, we provide insight on best practices and limitations on quantifying the linearity of GaN HEMTs using various linearity performance metrics. We propose using communication standard-based metrics such as adjacent channel power ratio (ACPR) and error vector magnitude (EVM) to account for realistic device performance at the circuit and system level. Using Keysight ADS Verification Test Bench (VTB), we show that a device with 1.3 dB higher OIP3 results in 1.17% and 1.1 dB worse EVM and ACPR, respectively, under backed-off conditions, when compared to a device with lower OIP3.

Best Practices to Quantify Linearity Performance of GaN HEMTs for Power Amplifier Applications

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9160876

**Abstract:**

The data rate-times-distance product in mm-wave dielectric waveguide (DWG) communication links is usually limited by waveguide dispersion. This letter presents the DWG\'s baseband impulse response in the context of a homodyne receiver and introduces a continuous-time linear equalizer able to minimize such dispersion. The desired transfer function is implemented with inverter-based transconductance cells. The simulation and measurement results at 10-Gbps data rate show eye-opening improvement at two distances (10 and 15 m) and carrier frequencies (140 and 160 GHz). The equalizer occupies 80 × 32 μm2 in GLOBALFOUNDRIES 22-nm FD-SOI.

A 10-Gbps Continuous-Time Linear Equalizer for mm-Wave Dielectric Waveguide Communication

**Session Chairs:**
 Ferdinando Iucolano, ST Microelectronics, Italy
 Davide Bisi, Transphorm Inc, United States

GaN RF

technical paper

The IEEE Workshop on Wide Bandgap Power Devices & Applications (WiPDA) provides a forum for device scientists, circuit designers, & application engineers from the Power Electronics & Electron Devices Societies to share technology updates, research findings, experience & potential applications.

**Topics of interest**

* Heteroepitaxial & Bulk Materials Growth
* Gate Dielectrics & Surface Passivation
* Device Structures & Fabrication Techniques
* Device Characterization & Modeling
* Very-High Efficiency or Compact Converters
* Safe Operating Areas of Wide Bandgap Devices, Including Short Circuit, Spike, & Transient Tolerance
* Harsh Environment (High Temperature) Operation & Reliability
* Packaging Power Modules & ICs
* Hard-Switched & Soft-Switched Application Analysis
* Gate Drive & Other Auxiliary Circuits
* High-Performance Passive Components
* Applications in Renewable Energy & Energy Storage, Transportation, Industrial Drives, & Grid Power Systems
* Wide Band Gap System Design Philosophies & Strategies
* Radio Frequency (RF) GaN (New)
* Technology Roadmap of Wide Bandgap Including Devices, Applications and Packaging (New)

### Please select the button below to view and download the session papers. The Virtual Proceedings PDF can be downloaded [here.](https://drive.google.com/file/d/171y2_u63V-pc9-bC-eZgHLzJou2oCfST/view?usp=sharing)

[![](https://assets.underline.io/uploads/markdown_image/1/image/c8e1b0a2881d3bb0a75ece4761f43c9f.png)](https://drive.google.com/drive/folders/1GWEFLzH6K4aUBaJiBFJDw4x9sKLTl6-g?usp=sharing)


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IEEE WiPDA 2021

The IEEE Workshop on Wide Bandgap Power Devices & Applications (WiPDA) provides a forum for device scientists, circuit designers, & application engineers from the Power Electronics & Electron Devices Societies to share technology updates, research findings, experience & potential applications.

**Session Chairs:** Mattias Palm, Ericsson; Turner Walker, Nvidia Corporation

E3L-3: Data Converters & Chip-to-Chip Interfaces (ESSCIRC 2020 SSC-L special edition)

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
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* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

To access ESSCIRC ESSDERC 2021, you must pre-register for the conference.  Instructions on how to access the event will be provided directly to attendees and included on the ESSCIRC ESSDERC conference website. [Register now](https://www.esscirc-essderc2021.org/).

Please register for the ESSCIRC conference to join the event.

ESSCIRC ESSDERC 2021

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.





Boris Murmann

2

1

Presentations

Best Practices to Quantify Linearity Performance of GaN HEMTs for Power Amplifier Applications

A 10-Gbps Continuous-Time Linear Equalizer for mm-Wave Dielectric Waveguide Communication

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