
Lin Hou
Western Digital
reliability
w2w hybrid bonding
controlled-iv
1
presentations
SHORT BIO
Lin Hou was born in Henan, China. She earned a Master of Engineering degree from the University of Leuven in Belgium and a PhD in Material Engineering from KU Leuven & IMEC with a focus on 3D bonding technique and 3D process integration. She joined Western Digital as Staff Engineer in R&D Engineering, Memory Technology from 2020. She’s currently an assignee at IMEC (Interuniversity Microelectronics Centre) with working on the reliability of W2W hybrid bonding as part of Western Digital’s cooperative research program.
Presentations

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
Lin Hou and 7 other authors