Lin Hou was born in Henan, China. She earned a Master of Engineering degree from the University of Leuven in Belgium and a PhD in Material Engineering from KU Leuven & IMEC with a focus on 3D bonding technique and 3D process integration. She joined Western Digital as Staff Engineer in R&D Engineering, Memory Technology from 2020. She’s currently an assignee at IMEC (Interuniversity Microelectronics Centre) with working on the reliability of W2W hybrid bonding as part of Western Digital’s cooperative research program.