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Lin Hou

Western Digital

reliability

w2w hybrid bonding

controlled-iv

1

presentations

SHORT BIO

Lin Hou was born in Henan, China. She earned a Master of Engineering degree from the University of Leuven in Belgium and a PhD in Material Engineering from KU Leuven & IMEC with a focus on 3D bonding technique and 3D process integration. She joined Western Digital as Staff Engineer in R&D Engineering, Memory Technology from 2020. She’s currently an assignee at IMEC (Interuniversity Microelectronics Centre) with working on the reliability of W2W hybrid bonding as part of Western Digital’s cooperative research program.

Presentations

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism

Lin Hou and 7 other authors

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