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Ivan Ndip

Fraunhofer IZM

thz

5g

6g

mmwave

packaging

1

presentations

29

number of views

SHORT BIO

Ivan Ndip has been with Fraunhofer IZM for over 20 years, where he currently leads the Department of RF & Smart Sensor Systems. He also leads the Fraunhofer IZM Branch Lab for High-Frequency Sensors & High-Speed Systems in Cottbus. Ivan taught graduate courses in the Faculty of Electrical Engineering and Computer Sciences at the Technische Univerisitaet Berlin for 10 years. He has been teaching Professional Development Courses (PDCs) to practicing engineers and scientist worldwide for over 11 years. He has authored and co-authored over 210 scientific pub-lications in peer-reviewed journals and conference proceedings as well as over 35 German, European and US patents. He has won numerous best paper, national and international awards. Ivan received the Dipl.-Ing. (M.Sc.) and Dr.-Ing. (Ph.D.) degrees in electrical engineering from the Technische Universitaet Berlin, and the Dr.-Ing. habil. degree also in electrical engineering from the Brandenburg University of Technology, Cottbus-Senftenberg, Germany. He served as Director in the IMAPS Executive Council from 2016 to 2020. He is a Life Member and Fellow of IMAPS as well as Senior Member of IEEE.

Presentations

Packaging requirements for mmW & THz wireless applications

Ivan Ndip

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