5G and Beyond 5G applications are driving research towards highly integrated PA modules with multiband capabilities. Multiband requirements, along with the need for reduced power consumption, make the PA design highly critical since high PAPR signals require the PA to be backed-off from its peak power in order to achieve the necessary system linearity. This calls for an important shift from traditional PA design to more advanced PA architectures capable of handling signals with high PAPR while maintaining high efficiency and linearity on a broad frequency range. In addition, achieving high performance and reliability while maintaining compact size requires innovative thermal and electromagnetic management schemes. In this talk, I will give an overview of the challenges, recent progress and trends related to the integration of high efficiency PA design in RF-SOI technology for mobile applications operating below 6GHz.

High-Efficiency Power Amplifiers in RF-SOI technology: Challenges, Progress and Perspectives

Demand for better wireless signals has increased with larger networks and connected devices. Wi-Fi has also increased in speed, allowing more connections through improvements in frequency used and data transmission. The enhancements for Wi-Fi 6 impose new design challenges. One of the requirements is on the amplifier section where higher linearity and a flatter response curve is necessary. Accomplishing this requires better designed RF components. Another challenge is efficiency and thermal considerations. More advanced processing and RF requires power and creates heat, and building wireless equipment into a compact pleasing form-factor makes thermal management more difficult. The smaller size and lower cost require the IC and packaging technologies to move to a higher level of integration, leading to increased integration complexity.
In this talk, the design challenges for the integration of High-Power Wi-Fi 5/6 Front End Module using advanced package approaches like Fan-Out Wafer-Level Packaging is presented. As an example, PA/Package co-design methodology is described on a High Power SOI-CMOS PA module for 2.4GHz WiFi 6 applications.


Pascal REYNIER

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