**Please read the paper on the following link:**

https://1worldcontent.com/ess/9162.pdf

**Abstract:**

This paper presents a low-power and high-linearity noise-shaping SAR ADC that employs a duty-cycled amplifier and a mismatch error shaping technique. The power-efficient duty-cycled amplifier with 18x gain and two passive integrators provide 2nd-order noise shaping to improve in-band noise attenuation. Mismatch error shaping with a two-level digital prediction scheme is used to 1st-order shape the capacitive DAC mismatch errors without sacrificing the input signal range. The proposed ADC is fabricated in 65 nm CMOS technology and achieves 80 dB peak SNDR and 98 dB peak SFDR in a 31.25 kHz bandwidth, leading to a Schreier FoM of 176.3 dB.

An 80dB-SNDR 98dB-SFDR Noise-Shaping SAR ADC with Duty-Cycled Amplifier and Digital-Predicted Mismatch Error Shaping

**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9171283

**Abstract:**

This work presents a simplex and a full duplex digital communication interface that enhance the energy efficiency of chip-to-chip digital communication in low speed low power systems. Thanks to the all-dynamic architecture, the proposed interfaces allow efficient power scaling and can provide a BER of 5^10-12. The simplex and full duplex interfaces achieve an energy consumption of 0.38pJ/b and 1.2pJ/b respectively. The simplex interface achieves a power reduction of 2× to 27× compared to conventional LVCMOS for data rates from 10kb/s to 50Mb/s. The full duplex interface achieves a power reduction of 5× to 11× for data rates from 100kb/s to 50Mb/s.

A 0.38pJ/B Simplex and a 1.2pJ/B Full Duplex Chip-to-Chip Digital Communication Interface with Data Rate and Load Capacitance Adaptability

**Session Chairs:** Piero Malcovati, University of Pavia; Li Qiang, University of Electronic Science and Technology of China

D3L-2: SAR ADC

technical paper

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

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ESSCIRC ESSDERC 2021

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.





**Session Chairs:** Mattias Palm, Ericsson; Turner Walker, Nvidia Corporation

Yuting Shen

2

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SHORT BIO

Presentations

An 80dB-SNDR 98dB-SFDR Noise-Shaping SAR ADC with Duty-Cycled Amplifier and Digital-Predicted Mismatch Error Shaping

A 0.38pJ/B Simplex and a 1.2pJ/B Full Duplex Chip-to-Chip Digital Communication Interface with Data Rate and Load Capacitance Adaptability

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