**Please read the paper on the following link:**

https://ieeexplore.ieee.org/document/9134399

**Abstract:**

This paper describes a 112–134-Gb/s PAM-4 wireline receiver (Rx) designed and fabricated in 7-nm CMOS FinFET technology. The Rx includes a T-Coil-assisted on-die termination (ODT), an adaptable continuous-time linear equalizer (ACTLE), a time-interleaved ADC (TI-ADC), clock generation, clock distribution, feed-forward equalizer (FFE), decision feedback equalizer (DFE), and calibration. The TI-ADC is implemented as a 56–67-GSa/s, 36-way arrangement of dualcomparator SAR ADCs (SAR subADCs). The Rx achieves BER better than 1e-4 for a data rate as high as 127 Gb/s, with 3.2e-4 BER at 134.4 Gb/s, over a 15-dB die-to-die loss channel and achieves 3e-6 BER over a 33-dB die-to-die channel loss at 28-GHz Nyquist while consuming 5.1 pJ/b of power, excluding DSP power.

A 112–134-Gb/S PAM4 Receiver Using a 36-Way Dual-Comparator TI-SAR ADC in 7-nm FinFET

**Session Chairs:** David Ruffieux, CSEM SA; Gernot Hueber, Silicon Austria Labs

D2L-3: RF & Wireless Communications (ESSCIRC 2020 SSC-L special edition)

technical paper

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

To access ESSCIRC ESSDERC 2021, you must pre-register for the conference.  Instructions on how to access the event will be provided directly to attendees and included on the ESSCIRC ESSDERC conference website. [Register now](https://www.esscirc-essderc2021.org/).

Please register for the ESSCIRC conference to join the event.

ESSCIRC ESSDERC 2021

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.





Haritha Eachempatti

1

18

Presentations

A 112–134-Gb/S PAM4 Receiver Using a 36-Way Dual-Comparator TI-SAR ADC in 7-nm FinFET

Stay up to date with the latest Underline news!

PRESENTATIONS

CONFERENCES

COMPANY

RESOURCES