Electrocorticography (ECoG) is a critically important neuroscientific tool for recording neural activity in the cerebral cortex. Advances in recent years have produced high-resolution ECoG arrays, which have enabled brain-machine interface (BMI) applications such as speech and motor intention decoding systems. Alternatively, cortical activity can be studied using optical tools such as genetically encoded calcium indicators (GECIs) and optogenetics. Optical access to the brain is typically achieved with a small craniotomy covered by a transparent window. Electrophysiology and optical imaging provide complementary neural sensing capabilities: electrophysiological recordings have high temporal resolution, while optical imaging allows recording of genetically-defined populations at high spatial resolution. Combining these two modalities for simultaneous large-scale, multimodal sensing of neural activity across multiple brain regions can be very powerful. To this end, many research groups have developed transparent ECoG arrays that can be used simultaneously with optical recording methods in small rodents and nonhuman primates. These devices are made possible by using transparent conductive materials such as graphene or indium tin oxide (ITO). Alternatively, poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) is a biocompatible transparent organic conductor which is routinely used to coat chronic neural interfaces in order reduce the interfacial impedance of the contact site. We have developed inkjet-printed transparent PEDOT:PSS microelectrodes which use a novel ring-shaped geometry to reduce interfacial impedance and improve charge injection. [1] This is accomplished by taking advantage of the volumetric capacitance in PEDOT:PSS. Ring-shaped microelectrodes with diameters ranging from 300 µm to 550 µm were fabricated by inkjet-printing PEDOT:PSS, encapsulating with Parylene C, and then exposing a contact site that is much smaller than the microelectrode outer diameter. This unique structure allowed the encapsulated portion of the microelectrode volume surrounding the contact site to participate in signal transduction, which reduced impedance and enhanced charge storage capacity. For the same size contact site, increasing the outer diameter of the encapsulated electrode from 300 to 550 μm reduced the impedance from 294 ± 21 to 98 ± 2kΩ, respectively, at 1 Hz. Similarly, the charge storage capacity was enhanced from 6 to 21 mC cm-2. The PEDOT:PSS microelectrodes provide a low-haze, high-transmittance optical interface, demonstrating their suitability for optical neuroscience applications. They remained functional after a million 1 V stimulation cycles, up to 600 μA of stimulation current, and more than 1000 mechanical bending cycles. We have integrated these inkjet-printed PEDOT:PSS electrodes into transparent cranial windows for multi-modal recording of activity from the cortex.[2] Implanted on transgenic mice expressing the Calcium (Ca2+) indicator GCaMP6f in excitatory neurons, these “eSee-Shells” provide a robust opto-electrophysiological interface for over 100 days. eSee-Shells enable simultaneous mesoscale Ca2+ imaging and electrocorticography acquisition from multiple brain regions covering 45 mm2 of cortex under anesthesia and in awake animals. These eSee-Shells allow either mesoscale imaging across the entire field of view (FOV) or random-access cellular level imaging of small FOVs throughout ≈45 mm2 of the cerebral cortex, an area that is an order of magnitude larger than previous transparent ECoG electrode arrays. [1] P. D. Donaldson and S. L. Swisher, Physica Status Solidi (a) 2022. [2] P. D. Donaldson et al., Adv. Healthcare Mater. 2022.

Transparent, Inkjet-Printed PEDOT:PSS Electrotrode Arrays for Large-Area Multimodal Neural Interfaces

As the complexity of flexible electronic devices such as displays and sensors has increased, new plastic-compatible manufacturing methods are becoming necessary to produce high-yield, low-defect flexible circuits. While solution-processed methods such as printing can be used to fabricate circuits on low-temperature substrates, printing is not always a feasible option to realize complex, high-density circuits with small devices. In particular, highresolution display applications typically require single-micron feature sizes and excellent uniformity over large-area substrates. For these applications, more precise fabrication techniques such as photolithography are required. However, due to the poor dimensional stability of polymers, even low-temperature processes such as soft bakes during lithography can alter the substrate dimensions. The problem of dimensional stability can be overcome by attaching the polymer film to a rigid carrier during device fabrication, then releasing the polymer substrate with the fully fabricated device layer on top. For this reason, the separation of polymer films from rigid carriers remains a crucial step in creating next-generation flexible electronics. In this talk, we will discuss a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer films from rigid carriers. PLO uses broadband light (200 nm — 1100 nm) from a flashlamp to lift off a polymer film from a rigid carrier coated with a light-absorbing layer (LAL), where the polymer film may contain functional devices [1]. Compared to a raster process such as excimer laser lift-off, the PLO process is advantageous as it can enable large area lift-off (150 mm x 75 mm) in one flash of light lasting between 100- 200 us, thus enabling higher throughput. Furthermore, the LAL prevents direct illumination of the polymer substrate during lift-off and facilitates cleaner lift-off without polymer ashing. The LAL also makes PLO a polymer-agnostic process, enabling lift-off of a wide range of polymers. We will discuss our recent work fabricating flexible thin-film transistors (TFTs) using PLO [2]. Polyimide with a low coefficient of thermal expansion (CTE) was used to minimize residual film stress. Indium zinc oxide (IZO) TFTs were fabricated on the polyimide films and subsequently released from the carrier using PLO. The released devices demonstrated no significant changes after the PLO process, yielding a mobility of ~3 cm“V_s__ before and after liftoff. The flexible TFTs were robust to bending stress, showing no notable decrease in mobility while bent with a 10 mm radius of curvature. When combined with the ability to successfully separate the PI from the carrier, the low-CTE PI creates a robust fabrication platform for flexible electronics that allows conventional patterning and deposition techniques to be used on a plastic substrate while maintaining dimensional stability with processing temperatures up to 380 °C. A 3D finite element model indicates that the polymer/LAL interface reaches above 800 °C during PLO, but the top surface of the PI remains below 120 °C. The model shows that the maximum temperature at the device layer during PLO is strongly impacted by the thickness and material properties of the polymer film, highlighting the value of the model to guide PLO device design. This work demonstrates the feasibility of PLO to successfully release polyimide substrates containing flexible electronic devices from glass carriers after withstanding conventional lithographic processing methods. [1] R. Hendriks and K. A. Schroder, “Method for performing delamination of a polymer film. U.S. Patent 10,011,104.,” U.S. Patent 10,011,104, Jul. 03, 2018 [2] A. M. Weidling, V. S. Turkani, V. Akhavan, K. A. Schroder, and S. L. Swisher, “Large-Area Photonic Lift-off Process for Flexible Thin-Film Transistors,” in press.

Large-Area Photonic Lift-off Process for Flexible Thin-Film Transistors

Metal oxides (e.g., In2O3, InZnO) have been demonstrated to be excellent materials for flexible electronics. Solution-processed methods offer a cost-effective and high uniformity route to deposit the metal oxides on a variety of substrates. However, post-processing is often necessary and it becomes a challenge on plastic substrates. Here, we explore photonic curing to process the semiconductor material without substantially heating the plastic substrate.

Photonic Curing: Rapid Thermal Processing of Oxide Thin-film Transistors on Plastic

Abstract Body: Metal oxide semiconductors such as indium gallium zinc oxide (IGZO) and indium zinc oxide (IZO) have received significant attention over the past few decades due to their desirable electrical and optical properties. Sol-gel techniques are commonly employed to deposit these materials because of the simplicity of the synthesis and the ability to easily tune the film composition. These sol-gel based oxide semiconductors often demonstrate high field-effect mobility even in the amorphous phase, but temperatures of at least 300 C are typically required to decompose the sol-gel and form high-quality semiconductor film. The desire to create high-quality flexible transistors on low-temperature plastic substrates has driven an investigation into alternative thermal processing methods for oxide semiconductors. One such option being explored is pulsed-light processing based on flashlamps, commonly known as photonic curing. Photonic curing offers advantages over conventional thermal processing methods such as ultra-short processing time and compatibility with low-temperature substrates. However, previous work on photonically cured thin-film transistors (TFTs) often results in significant heating of the entire substrate rather than just the thin film at the surface. In this talk, we will discuss our recent work using photonic curing to rapidly and effectively convert metal oxide sol-gels to realize high-quality TFTs. Sol-gel indium zinc oxide (IZO) based TFTs are photonically cured with efficient molybdenum gate absorbers using a xenon flashlamp (NovaCentrix PulseForge 1300) using intense white light delivering radiant energy up to 6 Jcm-2. Simulations indicate that the IZO film reaches a peak temperature of ~590 C while the back of the glass substrate stays near room temperature. This process yields TFTs with a field effect mobility above 20 cm2V-1s-1 and an IOn/IOff ratio approaching 108, which exceeds the performance of samples annealed at 500 C for 1 hr. We will discuss the requirements and design guidelines for photonic curing metal oxide semiconductors for high-performance TFT applications, focusing on the importance of effective gate absorbers and optimized pulse designs to efficiently and effectively cure the sol-gel films.

Photonic Curing of Solution-Processed Indium Zinc Oxide Thin-Film Transistors

thin-film transistor, indium oxide, indium zinc oxide, high-k, semiconductor modeling

Mobility Boost in Transparent Oxide Semiconductors with High-κ Gated TFTs

T: Organic Devices and Molecular Electronics

technical paper

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials. This year’s event will feature a plenary session, topical sessions, a poster session and more.

EMC is coordinated with the Device Research Conference (DRC). This recognizes the strong interaction between device and electronic materials research and provides fruitful exchange of information between attendees of both Conferences.

EMC 2023

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials. 

Q: Oxide Semiconductor Devices, Defects and Transport

After two years of virtual conferences, we're excited to host EMC 2022 in person at The Ohio State University in Columbus, Ohio. In addition to cutting-edge technical presentations given in multiple parallel sessions, opportunities to network with colleagues will be present throughout the conference. The size and format of the meeting makes networking easy, whether you have been coming to the conference for many years or are a first-time attendee.

EMC is coordinated with the Device Research Conference (DRC), which will be held the same week, from June 26-29. This recognizes the strong interaction between device and electronic materials research and provides fruitful exchange of information between attendees of both Conferences.

For information on the 80th Device Research Conference, please visit the DRC 2022 website.



EMC 2022

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials. This year’s event will feature a plenary session, topical sessions, a poster session and more.

**Please use the button above to access the live recording.**
 
 Session Chair: Sarah Swisher

Session 7 - Thin Film Transistors

[![](https://assets.underline.io/uploads/markdown_image/1/image/985c8a40b04e56675221c8549975de3c.png)](https://drive.google.com/file/d/1B70nPIeeeqdG4UU70NlYXuKVOHLRuJEo/view?usp=sharing)

### ** History of DRC**
The Device Research Conference (DRC) began in the pre-transistor era with the 1942 establishment of the Conference on Electron Device Research (CEDR). Following William Shockley’s 1948 CEDR presentation of the transistor device, the Solid-State Device Research Conference (SSDRC) was established, with invitation-only attendance.

In the ensuing decades, many exciting firsts were presented at SSDRC, including the use of impurity diffusion in silicon and germanium, the first practical MOSFET, and the first lattice-matched heterojunction.

In 1969, under the leadership or Herbert Kroemer and Cal Quate, the CEDR and SSDRC merged into DRC. In 1970, attendance was opened to all, and the first DRAM (dynamic random-access memory), room temperature lasers, and first CCD (charge-coupled device) were reported—all in the same 1970 DRC meeting!

1976 saw the first official coordination of tandem meetings between DRC and the Electronic Materials Conference (EMC) to bring together the electronic materials and device communities—a custom which persists to this day. In 1991, DRC began publishing its digest with IEEE; they can all be found [here on IEEE Xplore](https://ieeexplore.ieee.org/xpl/conhome/1000199/all-proceedings). Throughout this period, DRC featured reports of many novel and record-setting devices, including the HEMT (High Electron Mobility Transistor), VCSEL (Vertical Cavity Surface Emitting Laser), HBT (Heterojunction Bipolar Transistor), and nanoscale MOSFETs.

In recent years, DRC has continued to be the world’s premier forum to present innovative semiconductor device research with work on organic thin film transistors, graphene and carbon nanotube transistors, and 2D materials all featuring prominently in the 1990s through to the present day. In 2017, we celebrated DRC’s 75th anniversary with special sessions and an [article in the Journal of the Electron Device Society](https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8168249&isnumber=8232486). DRC technical topics continue to evolve with emerging device trends such as memory devices, quantum devices, optoelectronics/photonics, and wide bandgap power devices to reflect the exciting work being done by a diverse community of device engineers around the globe.

Today, as we look forward to the next 75+ years of device innovation, DRC continues to lead the way in showcasing top-caliber research, facilitating vibrant discussion and debate and acting as a platform to nurture the next generation of device engineers. We welcome you to join us at the next DRC!

To learn more about DRC's history, please see [Aaron Franklin, Debdeep Jena and Deji Akinwande, "75 Years of the Device Research Conference—A History Worth Repeating," in IEEE Journal of the Electron Devices Society, vol. 6, pp. 116-120, 2018. doi: 10.1109/JEDS.2017.2780778](https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8168249&isnumber=8232486).

### **Topics**
* Biological Devices
* Devices for Extreme Conditions
* Heterogeneously Integrated Devices
* Memory Devices
* Modeling and Simulation of Devices
* Nanoscale and Vacuum Devices
* Optoelectronic and Optical Devices
* Other Emerging Devices
* Power Devices
* Quantum Devices
* RF and Terahertz Devices
* Spintronic and Magnetic Devices
* Thin-film Devices
* Wide-bandgap Devices
 
### **Invited Speakers**
* Patrick Fay, University of Notre Dame
* Susanne Hoffmann-Eifert, Peter Grünberg Institute
* Sanghyeon Kim, Korea Advanced Institute of Science and Technology
* Sriram Krishnamoorthy, University of California, Santa Barbara
* Mario Lanza, King Abdullah University of Science and Technology
* Xiuling Li, The University of Texas at Austin
* Marko Radosavljevic, Intel Corporation
* Siddharth Rajan, The Ohio State University
* Giordano Scappucci, Delft University of Technology
* Fisher Yu, University of Arkansas
* Wenjuan Zhu, University of Illinois at Urbana-Champaign




Registration is required to attend this event. If you have not already done so, please use the link below to register for a ticket to the conference:

https://www.mrs.org/drc-2022/registration

Registration Is Required

DRC 2022

DRC continues to be the world’s premier forum to present innovative semiconductor device research with work on organic thin film transistors, graphene and carbon nanotube transistors, and 2D materials all featuring prominently in the 1990s through to the present day. In 2017, we celebrated DRC’s 75th anniversary with special sessions and an article in the Journal of the Electron Device Society. 
DRC technical topics continue to evolve with emerging device trends such as memory devices, quantum devices, optoelectronics/photonics, and wide bandgap power devices to reflect the exciting work being done by a diverse community of device engineers around the globe.

PP: Oxide Thin Film Transistors

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials. This year’s event will feature a plenary session, topical sessions, a poster session and more.

EMC is coordinated with the Device Research Conference (DRC), which will be held during the same week, from June 20-23. This recognizes the strong interaction between device and electronic materials research and provides fruitful exchange of information between attendees of both Conferences.

![](https://assets.underline.io/uploads/markdown_image/1/image/eb26c24a18d5d1030616afa4f993cf89.png)
	
<a href="https://www.mrs.org/docs/default-source/meetings-events/mrs-conference-services/2021/emc-2021/2021-emc-program-at-a-glance-6-16-21.pdf?sfvrsn=e39f950c_4">Latest Program-at-a-Glance</a>

<a href="https://drive.google.com/file/d/1eiS1ao4p83VNy8xgHs3Rls7gTQjx7Rc4/view?usp=sharing">Full Program with Abstracts</a>

EMC 2021

(DRC) Poster Session 2

poster

**[DOWNLOAD THE DRC 2021 DIGEST](https://drive.google.com/file/d/17_-pkYf4IBbVuNYgohTf0iZJORVGp_uN/view?usp=sharing)**

**[DOWNLOAD A COPY OF THE FINAL DRC PROGRAM](https://drive.google.com/file/d/1Ek8UIDCowpLq0z2hXav5tn67FboxS03N/view?usp=sharing)**

For almost eight decades, the Device Research Conference (DRC) has brought together leading scientists, researchers and students to share their latest discoveries in device science, technology and modeling. Notably, many of the first public disclosures of key device technologies were made at the DRC. This year marks the 79th anniversary of the DRC—the longest running device research meeting in the world. As we commemorate this meeting, the high-caliber technical sessions will be highlighted by plenary talks and invited talks by international research pioneers and leaders behind modern electronic technology.

Given the ongoing global health concerns associated with COVID-19 (Coronavirus), the DRC leadership has decided to hold the 2021 Device Research Conference in a virtual (online) format. This follows an enormously successful 2020 DRC held virtually, in which we had record attendance and worldwide participation of more than 875 attendees from 33 countries.

The 2021 Conference will feature:

* Informative, timely short courses in rapidly developing fields
* Oral and poster presentations on electronic/photonic device experiments and simulations
* Plenary and invited presentations given by worldwide leaders
* Evening “rump” session
* Strong student participation and Student Paper Awards

DRC is held in coordination with the Electronic Materials Conference (EMC), which will occur the same week, from June 23-25. As has happened in person in past years, in 2021, the virtual DRC and EMC sessions on the shared day, Wednesday, June 23, will be open to all attendees from both conferences. This recognizes the strong interaction between device and electronic materials research and provides fruitful exchanges of information between attendees of both Conferences. For information on the 63rd Electronic Materials Conference, please visit the [EMC 2021 website.](https://www.mrs.org/63rd-emc/)

2021 DRC individual presentation videos will become available in Underline at the end of each technical session. A recording of each full live session with Q&A will be posted later during the conference. To facilitate re-viewing of recorded talks and sessions, the DRC Underline site will remain open through 11:59pm (US EDT) on July 7th. DRC Conference registration will remain open at www.mrs.org/drc-2021/registration through June 30th.

Thank you for joining us at the 2021 Device Research Conference!

**General Chair**
 Zhihong Chen, Purdue University

**Technical Program Chair**
 Becky (R.L.) Peterson, University of Michigan

**Technical Program Vice-Chair**
 Gregg Jessen, BAE Systems

You can register for the 79th Device Research Conference with the following link. https://www.mrs.org/drc-2021

DRC 2021

For almost eight decades, the Device Research Conference (DRC) has brought together leading scientists, researchers and students to share their latest discoveries in device science, technology and modeling. Notably, many of the first public disclosures of key device technologies were made at the DRC. This year marks the 79th anniversary of the DRC—the longest running device research meeting in the world. As we commemorate this meeting, the high-caliber technical sessions will be highlighted by plenary talks and invited talks by international research pioneers and leaders behind modern electronic technology.

Sarah Swisher

5

28

SHORT BIO

Presentations

Transparent, Inkjet-Printed PEDOT:PSS Electrotrode Arrays for Large-Area Multimodal Neural Interfaces

Large-Area Photonic Lift-off Process for Flexible Thin-Film Transistors

Photonic Curing: Rapid Thermal Processing of Oxide Thin-film Transistors on Plastic

Photonic Curing of Solution-Processed Indium Zinc Oxide Thin-Film Transistors

Mobility Boost in Transparent Oxide Semiconductors with High-κ Gated TFTs

Stay up to date with the latest Underline news!

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