Carbon fiber veils are beneficial materials to functionalize the adhesively bonded joints which are damaged when they need to be debonded. The effects of three different carbon fiber veils on the mechanical, thermal and electrical characteristics of epoxy adhesive systems were examined. In comparison to the neat epoxy configurations, carbon fiber veil interleaving enhanced storage modulus, thermal diffusivity and lap shear strength (LSS) of the adhesive joints while lowering specific heat capacity (Cp) and glass transition temperature (Tg). Fourier-transform infrared spectroscopy (FTIR) analysis showed no chemical changes occurred in epoxy after heating at 100°C and interleaving a carbon fiber veil layer between two epoxy film adhesive layers. Surface roughness and water contact angle measurements were conducted to investigate the wettability of GFRPadherends. ANSYS coupled thermal-electric simulations displayed good agreement with Joule heat experiments. Thermomechanical debonding via Joule heating provided high debonding effectiveness in terms of requiring low force and time while providing no fiber-tearing on the surface of the adherends and heating the bonded region of the joints selectively.

Debonding of carbon fiber veil interleaved adhesively bonded glass fiber reinforced polymer (GFRP) joints

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