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VIDEO DOI: https://doi.org/10.48448/5fyf-sd04
PAPER DOI: https://doi.org/10.2351/7.0001149

technical paper

ICALEO 2023

October 18, 2023

Chicago, United States

Influence of Temperature and Beam Size on Weld Track Shape in Laser Powder Bed Fusion of Pure Copper Using Near-Infrared Laser System

keywords:

near-infrared laser system

pure copper

scaling laws

laser powder bed fusion

additive manufacturing

Additive manufacturing of copper using laser powder bed fusion, enables the production of highly complex components, with excellent heat and electrical conductivity. However, the processing of copper by means of near-infrared laser radiation, which is commonly used, is challenging due to its high reflectivity. Nevertheless, it has been demonstrated that high densities and electrical conductivities can be achieved using high power laser systems. In order to process pure copper with reliable quality with different machines, it is essential to understand the conditions at which a continuous weld track is formed. For this purpose, weld tracks with varying laser power and scan speeds were welded on a copper substrate plate with an applied powder layer. The preheating temperature of the substrate plate and the beam size were varied to test different process conditions. The melt pool depths and widths were measured and a relationship was elaborated. Based on these results, cube samples with discrete weld tracks on top were manufactured. The melt pool depth was measured and compared with the predicted melt pool depth to investigate the transferability of the elaborated relationship from substrate to process conditions. It was found that with rising preheating temperature and for larger beam diameters at the same peak intensity, the weld width and weld depths increase. Furthermore, continuous weld tracks formed reliably in the keyhole welding regime. A good agreement between the weld depth of weld tracks on substrate and the elaborated relationship was revealed. However, the weld tracks were shallower than predicted.

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