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Voltage surges induced by electrostatic discharge (ESD) impacts on the backside of an integrated circuit (IC) chip in flip-chip packaging potentially causes reliability problems and even leads to malfunctioning. On-chip voltage waveform monitor circuits on its frontside evaluate the surge as high as 200 mV when ESD gun at 200 V is discharged to the Si substrate backside through the contact resistance of 5 kΩ to the backside of a 350 µm thick Si substrate. The distribution of voltages over the frontside area of an IC chip is measured and explained with full-system level backside ESD simulation. 


IRPS 2022 Main Conference 

Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging

poster

#### Welcome to the 60th IEEE International Reliability Physics Symposium (IRPS)!

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**General Chair Welcome Message**

Welcome to IRPS 2022! When the IRPS Management Committee began making plans for Dallas, we recognized the strong desire by the reliability physics community to return to a face-to-face symposium that we last had in Monterey in 2019. But as time progressed, we recognized that travel restrictions were not being lifted as rapidly as we anticipated. Rather than leave out those of you who could not attend in person, we adopted a hybrid format allowing for both remote attendance and remote presentations. This is a first for IRPS and I am confident it will be a success for all.

With this new hybrid format, the symposium will return to the original five-day format with Tutorials and Year in Review on the first two days. The Technical Program, Keynote Talks, Workshops and Poster session will be held on the following three days. All of these (except Workshops and Posters) will be available via real-time streaming in the US Central Time zone with virtual attendees having Q&A access to the presenters. For those virtual attendees who cannot watch the live presentations, the material will be available on demand to all attendees for a month after the symposium with the ability to communicate with the authors.

In 2020, we were planning on co-hosting the International ESD Workshop (IEW) ESD workshop when the COVID-19 pandemic hit. For 2022, IEW will be seamlessly embedded into the IRPS Program and will sponsor three tutorials, an invited talk, two technical sessions and two evening workshops focused on ESD and latch-up. And we continue our
collaboration with our sister conference, European Symposium on Reliability of Electron Devices Failure Physics and Analysis (ESREF) by hosting their Best Paper and the International Integrated Reliability Workshop (IIRW) by hosting their Best Student Paper.

Our primary objective is to maintain the symposium’s leadership role in the reliability physics of microelectronic devices by attracting leading researchers to present their work and providing attendees the best place to access this information. With all the buzz in the media about whether Moore’s Law has hit its limit, IRPS has been promoting expertise developed in silicon-based reliability over the past sixty years and expanding into new material areas. This year, eight of the technical sessions are devoted to reliability in topics outside of traditional silicon, including wide bandgap GaN/SiC, emerging memory and neuromorphic computing. I hope our ability to draw these communities together will accelerate the cross-fertilization of ideas. 

The Technical Program consists of four keynote speakers, twenty-three invited speakers and eighty-seven oral presentations organized in thirty technical sessions on eighteen reliability topics. Over two evenings, there will be ten Workshops and sixty-six Poster presentations that are designed to allow in person attendees and experts to interact
with one another. With eighteen tutorials covering topics ranging from fundamental transistor and memory reliability all the way up to automotive and complex system-level reliability, this year’s symposium provides an excellent learning opportunity for engineers and scientists new to reliability as well as experienced individuals wanting to explore new
areas. The Year in Review, which serves as a summary of research in the past year, will cover 3D packaging, emerging memory and aging aware circuit designs.

Finally, I would like to express my extreme gratitude to our patrons and exhibitors, whose support makes IRPS possible.
And to all of you, our in person and virtual attendees, for supporting this symposium for sixty years!

**Charles W. Slayman, General Chair** 
**of 2022 IRPS Management Committee**
 
**About IRPS**

The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability, and to meet and network with reliability colleagues from around the world.

IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

The introduction of Ferroelectric Tunnel Junctions (FTJs) in embedded memory systems and in brain-inspired computing platforms requires a deeper understanding of their reliability and degradation mechanisms. Here we combine an extended stress/measure (DC I-V, PUND, C-f/G-f) set with a new FTJ small signal model, that specifically considers the physical properties and the role of each layer. Results reveal that reliability is ultimately limited by defect generation in the ferroelectric, in line with simulation on MFM devices. Asymmetry in the polarization-dependent leakage increase (due to defect generation) is found, that is associated with different stages (wake-up, fatigue, aging) of device lifetime.

Combining Experiments and a Novel Small Signal Model to Investigate the Degradation Mechanisms in Ferroelectric Tunnel Junctions

A constant current stress scheme is implemented for endurance study on OTS-PCM devices for the first time. It provides a feasible method to estimate the read/write endurance for cross-point PCM products, which can save testing time for chips qualification.          

Endurance Evaluation on OTS-PCM Device using Constant Current Stress Scheme

Endurance ~ 1012 cycling of ferroelectric (FE) and antiferroelectric (AFE) HfZrO2 (HZO) capacitors are achieved experimentally by adjusting the programming pulse width (tp). The correlation between switching polarization (△P) and fatigue behavior of high endurance is discussed. For long tp (= 1 µs), AFE exhibits excellent endurance with &gt; 1010 cycles as compared with FE ~ 109 cycles. With shortening tP, the endurances of FE and AFE are significantly improved. There is no significant degradation until &gt; 1011 cycling is observed for FE with tp=20ns. 

Correlation between Access Polarization and High Endurance (~ 1012 cycling) of Ferroelectric and Anti-Ferroelectric HfZrO2

Hafnium oxide-based ferroelectric tunnel junctions (FTJs) are novel nonvolatile memory devices with promising advantages such as non-destructive readout in comparison with conventional ferroelectric random access memories. Reliability aspects of FTJ devices need to be investigated, including endurance, retention, ferroelectric switching, breakdown characteristics, and memory window. These characteristics exhibit promising results at room temperature; however, further analysis is required at different operating temperatures. In this work, we demonstrate the FTJ device characteristics at different temperatures varying from -40 °C to 60 °C.

Impact of Temperature on Reliability of MFIS HZO-based Ferroelectric Tunnel Junctions

To enable high-density cross-point arrays of magnetic memory a suitable access device is necessary. A promising candidate for this role is a metal-semiconductor-metal (MSM) tunneling device. In this work, the operation of an ultrathin Pt\6nm a-IGZO\Pt stack as an MSM selector is discussed. The focus is given to understanding the breakdown mechanism at high current regime, which prevents it from reaching the target current density. The breakdown is preceded by a gradual degradation process, which is manifested as an increase in high-field current after prolonged stress. This effect is recoverable – current returns to original value after sufficient delay time. Based on these observations, we propose a mechanism, where increased high-field current can be explained as a decrease in Schottky barrier height arising from stress-induced increase in oxygen vacancies.

Degradation mechanism of amorphous IGZO-based bipolar metal-semiconductor-metal selectors

The self-protection of SOI RF switches is presented in this paper. TLP ESD test results show that the ESD protection performance of SOI RF switches is impacted by various parameters, including switch array gate channel length, finger width, finger number, and RF switch stack number. The physics of the SOI RF switch ESD protection mechanism is also studied by comparing TLP ESD test results from SOI RF switch splits and other ESD protection structures. It is concluded that the SOI RF switch self-protection process during ESD transients contains two mechanisms: NMOS channel conduction triggered by gate coupling effect and parasitic bipolar turning on. 

Characterization and Analysis of RF Switches in SOI Technology for ESD Protection

In this work, we demonstrate experimentally an RRAM-based IMC logic concept with strong resilience to RRAM variability, even after one million endurance cycles. Our work relies on a generalization of in-memory Scouting Logic, and we demonstrate it experimentally with up to 16 parallel devices, a new milestone for RRAM in-memory logic. Moreover, we combine IMC with a new smart Multi-Level-Cell (MLC) programming algorithm resilient to conductance relaxation and demonstrate experimentally, for the first time, an IMC RRAM-based MLC 2-bit adder.

Experimental demonstration of Single-Level and Multi-Level-Cell RRAM-based In-Memory-Computing with up to 16 parallel operations

This paper investigates the
characterization of charge trapping and its modelling on hafnia-based
ferroelectric field effect transistors (FeFETs). Defect characterization on
MOSFETs can be done by studying threshold voltage shifts (DVth) as a function of charging and
relaxation times. At positive gate voltages one expects electron trapping in
the gate oxide to result in a positive shift of the threshold voltage (Vth). However, on a FeFET those conditions
will induce polarization changes in the gate oxide leading to a negative Vth-shift, complicating the characterization
of defect levels. We aim to alleviate these difficulties by modelling the
polarization and trapping in FeFETs over a wide range of timescales, suitable
for defect characterization. We demonstrate quantitative agreement on long
timescales with a static polarization model while a time-dependent polarization
model can be used for qualitative agreement over a wide range of times from 30
ms to 2 ks.

Trap-polarization interaction during low-field trap characterization on hafnia-based ferroelectric gatestacks

Integrating CMOS circuits and qubits at cryogenic temperatures a key challenge to enable up-scaling of quantum computers. One approach to reduce power consumption is to optimize designs towards operation at lower supply voltages. However, this reduces the tolerable margins on variability and device to device variations. In this study, we present the time-zero variability and mismatch of nMOS transistors from room temperature down to 4K. We investigate the physical origins of variability at cryogenic temperatures. We estimate the influence of different on-current variability sources and observe that another source of mismatch, likely contact resistance, becomes dominant at low temperatures.

Temperature Dependent Mismatch and Variability in a Cryo-CMOS Array with 30k Transistors

While LDMOS is one of the most widely used power transistors it has persistent reliability issues (e.g., HCD), because of the high applied bias.  Several efforts have been made to model HCD in TCAD. However, the lack of a feasible experimental approach to extract in LDMOS, made it challenging to verify the  obtained from TCAD. Here, we demonstrate the capability of the S2PCP technique to extract,  quantify the spatial and temporal evolution, identify the differences between experimental and TCAD and suggest possible physical mechanisms responsible. This analysis establishes robustness and identifies the limitations of TCAD modeling. 

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Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging

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Combining Experiments and a Novel Small Signal Model to Investigate the Degradation Mechanisms in Ferroelectric Tunnel Junctions

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