France

A low-power radar solution for vital signs detection and indoor people sensing is presented. A basic radar theory and design challenges are discussed. How to choose frequency band is explained. System analysis including link budget, dynamic range and LO phase noise, is offered. 
A low power UWB FMCW radar IC is introduced with detailed measurement results as an example.

ESSCIRC ESSDERC Educational Events

Low-power 8GHz radar for vital sign monitoring

fmcw

radar

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

To access ESSCIRC ESSDERC 2021, you must pre-register for the conference.  Instructions on how to access the event will be provided directly to attendees and included on the ESSCIRC ESSDERC conference website. [Register now](https://www.esscirc-essderc2021.org/).

Please register for the ESSCIRC conference to join the event.

ESSCIRC ESSDERC 2021

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.





technical paper

The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits.
The level of integration for system-on-chip design is rapidly increasing.

This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers, and system designers is necessary. ESSCIRC and ESSDERC are governed by a common Steering Committee and share Plenary Keynote Presentations and Joint Sessions bridging both device and circuit communities.

Highlights:
* 3 joint keynote presentations
* 3 keynote presentations ESSCIRC
* 3 keynote presentations ESSDERC
* Invited papers with overall coverage of all aspects of advanced devices and circuits
* Presentation of IEEE and ESSCIRC/ESSDERC Awards
* Educational Events

JOINT PLENARY talks live broadcast: September 13, 2021 
ESSCIRC and ESSDERC KEYNOTE talks live broadcast: September 15, 2021 
LIVE Q&A INTERACTIVE sessions for all Conference Technical sessions: September 14 – 16 – 17, 2021 
LIVE Q&A INTERACTIVE sessions for all Educational Events: September 20-21-22, 2021 
(on demand videos available from September 6 until November 30, 2021)

**Please see here for the [ESSCIRC Guide](https://drive.google.com/file/d/10dghzuv4aQBty4QfTIY9Q8hXyqsue8Le/view?usp=sharing), [ESSDERC Guide](https://drive.google.com/file/d/10dx9y2tm9cHPDa4upNUYjfXCf44aPry5/view?usp=sharing), and the [Program at a Glance](https://drive.google.com/file/d/10eU0OLTXEpiNzI5hkqv4mSr43T8cedPP/view?usp=sharing)**

Please register for educational events at the following link: https://www.registerme.eu/event/esscirc-essderc-2021/

Please register for the ESSCIRC/ESSDERC Educational Events to join the event.

The Educational Events of ESSCIRC ESSDERC 2021. 

Demand for better wireless signals has increased with larger networks and connected devices. Wi-Fi has also increased in speed, allowing more connections through improvements in frequency used and data transmission. The enhancements for Wi-Fi 6 impose new design challenges. One of the requirements is on the amplifier section where higher linearity and a flatter response curve is necessary. Accomplishing this requires better designed RF components. Another challenge is efficiency and thermal considerations. More advanced processing and RF requires power and creates heat, and building wireless equipment into a compact pleasing form-factor makes thermal management more difficult. The smaller size and lower cost require the IC and packaging technologies to move to a higher level of integration, leading to increased integration complexity.
In this talk, the design challenges for the integration of High-Power Wi-Fi 5/6 Front End Module using advanced package approaches like Fan-Out Wafer-Level Packaging is presented. As an example, PA/Package co-design methodology is described on a High Power SOI-CMOS PA module for 2.4GHz WiFi 6 applications.


Addressing design challenges in High-Power Wi-Fi 5/6 Front End Modules

The hardware in fiber-optic communication typically consists of multiple chips in dedicated optical and electronic technologies packaged together.
While this approach leads to excellent performance, it is not as cost-effective compared to having both optics and electronics integrated on a single chip.
From this perspective, bulk CMOS technology is arguably the most cost-effective integrated platform available, though is not very well suited for optics.
Nevertheless, there have been multiple demonstrations of gigabit fully-integrated fiber-optic receivers in bulk CMOS, even for the telecom wavelengths with an energy below the silicon band gap.
In this talk we delve deeper in the relevant optical photodetector devices, as well as the circuits involved to realize such opto-electric integrated circuits.

Fiber-Optic Receivers in Bulk CMOS - More than just pn-diodes

Many smart-power, medical and power applications require full galvanic isolation between various power domains. Traditionally this isolation is accomplished by capacitive coupling, magnetic coupling or by optocoupling that all have their specific pros and cons. In this talk, the focus is on single-chip fully integrated opto-coupling in a commercial CMOS technology, aiming at smart power applications. Firstly the physics behind light generation and light detection in silicon are reviewed, which leads to a number of challenges for silicon-integrated opto-coupling systems. Secondly a number of solutions for these challenges are presented, at layout, device, circuit and system level that, combined, enable opto-couplers in commercial SOI CMOS technology. Lastly, measurement results are discussed.

Optocoupling in CMOS

Thick, reach-through CMOS SPADs will be introduced, which possess a large photon detection probability (PDP) for red and near-infrared wavelengths. Circuits for fast active quenching and reduction of afterpulsing will be shown. In addition, quenchers for excess biases up to four times the nominal supply voltage will be described. Furthermore, an outstanding model for PDP calculation inclusive optical transmission in isolation and passivation stacks will be presented. First results of thick-SPAD sensors in TOF applications will be added.

Thick SPADs and Readout Circuits for High Excess Bias

This presentatio in an introduction to Silicon Photonics for Datacommunication.
Objective is be to review the basics of Silicon Photonics : optical interconnects in datacenter, datarate evolution, the interest of silicon photonics, basic process and main devices physics.


An introduction to Silicon Photonics for Datacommunication

For a long time, there was high expectation of being able to integrate monolithically photonic devices on a single chip, following the path traced by the microelectronics industry.
Unfortunately, process complexity to manufacture photonic chips prevent large-scale production of PICs and the industry remained focused on the single components.
Nowadays the technology allows high level of integration to target a wide variety of applications through the standardization of photonic integration processes for InP and the introduction of process design kits.


Indium Phosphide Technology Platform for Photonics

A semiconductor laser can be modeled as a current controlled oscillator since it can be tuned using its gain section current. Therefore, a semiconductor laser can be phase and frequency locked to a reference laser using an electro-optical phase locked loop (EOPLL). In this talk, some of the EOPLL design challenges such as the effect of the loop delay and laser FM response will be discussed and applications of EOPLLs in optical synthesis and coherent communication will be presented.

Relative Phase Control of Lasers; From Optical Synthesis to Coherent Communication

In this talk, the design of jointly optimized broadband electronics and photonics underlying next-generation (>100GBaud) coherent transceivers is addressed. It is shown how to use SiGe BiCMOS to achieve complex functionality such as interleaving and equalization at analog bandwidths as high as 90GHz. Examples are provided how functionality such as equalization traditionally implemented in the electronics domain can be implemented in a photonic integrated circuit. Finally, options such as micro-transfer printing to densely integrate front-end electronics with optical modulators and detectors are presented.

Co-design and integration of broadband electronic and photonic IC’s for next-generation optical transceiver applications

This presentation describes the evolving landscape of 77-
81GHz automotive radar transceivers and shows the opportunities and challenges ahead in the quest for higher sensing performance.

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Next from ESSCIRC ESSDERC Educational Events

Addressing design challenges in High-Power Wi-Fi 5/6 Front End Modules

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A 60 GHz QDCO with 11 GHz Seamless Tuning for Low-Power FMCW Radars in 22-nm FDSOI

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COMPANY

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