VIDEO DOI: https://doi.org/10.48448/ks4f-t096

technical paper

ESSCIRC ESSDERC Educational Events

September 21, 2021

France

Modeling of Bulk and Interface Defects for Reliability Prediction on the Atomistic Scale.

Please log in to leave a comment

Downloads

SlidesTranscript English (automatic)

Next from ESSCIRC ESSDERC Educational Events

Packaging requirements for mmW & THz wireless applications
technical paper

Packaging requirements for mmW & THz wireless applications

ESSCIRC ESSDERC Educational Events

Ivan Ndip
Ivan Ndip

21 September 2021

Similar lecture

Transition Metal Defects 4H-SiC—Optical and Electronic Levels from First Principles
technical paper

Transition Metal Defects 4H-SiC—Optical and Electronic Levels from First Principles

EMC 2021

Timothy Wolfe and 2 other authors

24 June 2021

Stay up to date with the latest Underline news!

PRESENTATIONS

  • All Lectures
  • For Librarians
  • Resource Center
  • Free Trial
Underline Science, Inc.
1216 Broadway, 2nd Floor, New York, NY 10001, USA

© 2023 Underline - All rights reserved