IRPS 2023 Main Conference

Welcome to the 61st IEEE International Reliability Physics Symposium (IRPS)!

The 2023 IEEE International Reliability Physics Symposium (IRPS) was held in Monterey, California from March 26 to 30, 2023.

IRPS 2023 General Chair Welcome Message

Welcome to the 61st IRPS conference in-person in Monterey, California, and hosted virtually by Underline! On behalf of the management committee and board of directors, we are extremely pleased to offer a second year of hybrid conference with oral presentations available live virtually during Pacific Time Zone. IRPS is the preeminent conference for timely research on Reliability Physics of devices, materials, circuits, and products used in the electronics industry; this is where important reliability challenges and solutions are first discussed. The live hybrid experience includes morning Keynote Sessions, all technical program oral presentations, and a record setting 28 Tutorials. Videos will be posted within a few days for replay up to one year later. An email to all registrants has been sent out and online help is available during the conference. Once logged in, the simple way to re-enter Underline is through the Ex Ordo mobile app.

We expect this hybrid format to be an excellent way to attend IRPS 2023 and absorb a lot of fabulous content. Virtual attendees will be able to ask authors questions through the Underline platform. Gather.Town also allows virtual attendees the opportunity to meet up with fellow virtual attendees for impromptu conversations through-out the course of the conference. One may enable Gather.Town with one browser screen to signal to others that they are available for conversations with their name. Gather.Town technology has chat, audio, and video capability.

IRPS 2023 kicks off Sunday, March 26th Tutorials beginning 9am PT and continuing through 2:30pm PT on March 27th. IRPS Tutorials are a supreme method for the beginner, the intermediate, and the expert to become familiar with the basic concepts of semiconductor reliability engineering to advanced topics of reliability in new areas such as 2D materials or quantum computing. Tutorials are followed by the ever-popular Reliability Year in Review (YIR) which are three summaries of the last year’s publications featuring soft errors, SiC devices, and FEOL reliability of FINFET, nanowires, and nanosheet FETs.

Our 2023 Keynotes are solely comprised of senior executives from four notable companies beginning with the topic of continuing Moore’s Law and reliability trends from Intel’s Ann Kelleher followed by Transforming industries with trustworthy cloud to edge compute platforms form NVIDIA’s Gary Hicok. Wednesday morning commences with AMD’s Mark Fuselier covering “Reliability Challenges for the next decade of high performance compute”. Thursday morning features Ampere Computing’s Rohit Vidwans presenting on “Building Reliability into the Modern Cloud”.

The technical program has 3 parallel tracks with 18 technical sessions starting each day at 8am PT and concluding at nearly 6pm PT. The full program can easily be viewed here, at a glance and presentation descriptions can be found here, in the Ex Ordo app, or within Underline. The technical program committee consists of 250 experienced industry, university, and government agency diverse individuals who have all contributed towards IRPS previously or whose expertise IRPS has invited. Truly, the technical program committee is the “backbone” of IRPS and we seek to have a thriving committee with both fresh board of directors served several years on the TPC. This year’s technical program focus topics are embedded-in-product memory/neuromorphic compute, GAA-nanosheet-RibbonFETTM-Forksheets, and 3D IC advanced packaging.

Workshops and the Poster Reception will be LIVE only and are only available for in-person attendees. They will not be recorded or made available to virtual attendees. Poster presentations have a short video for virtual attendees. We encourage virtual attendees to ask questions or post comments about the papers using Q&A box on the Underline platform. Virtual attendees can start discussion before the conference begins, and continue after it ends. IRPS and the International ESD workshop have restarted a tradition of being co-located, with IEW registrants having full access to both IRPS and IEW technical program.

At the conclusion of the conference, IRPS will have both in-person and virtual prizes awarded randomly to survey participants. In-person attendees must be present to win. Virtual attendees must include their valid, registered email address to win. The number and level of the prizes will be directly scaled with the number of registrants, so please be sure to fill out the prize surveys in the Ex Ordo app! Finally, I would like to express my extreme gratitude to our patrons and exhibitors, whose support makes IRPS possible. And to all of you, our in-person and virtual attendees, for supporting this symposium for sixty-one years!

Chris Connor, General Chair of 2023 IRPS Management Committee

About IRPS
The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability, and to meet and network with reliability colleagues from around the world.